fan-out panel level packaging

Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging

“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with fan-out panel level packaging (FOPLP) technology. Both companies have invested and developed FOPLP for production successfully in 20... »

Fan-out Panel Production Becomes a Reality

Fan-out Panel Production Becomes a Reality

Fan-out panel level production is underway at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications.  The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC.  Future applications under consideration for panel production in... »

An Update on the Fan-out Panel-Level Packaging Consortium

An Update on the Fan-out Panel-Level Packaging Consortium

One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP).  In theory, the concept of taking fan-out from a 300-mm reconstituted wafer to a large panel format as a way to lower costs seems simple, and even the logical step. It’s not. Skeptics, many burned by the same low-cost advantage argument for inv... »

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at 10:32 pm, a magnitude 3.9 temblor near Alum Rock I thought could have been my neighbor dropping something heavy in the apartment upstairs, except that nobody lifts and drops anything that heavy, for that long, in the building where I live. No reports of damage, but the shaking came... »

SEMICON West 2017: The Semiconductor Industry at a Young 50

SEMICON West 2017: The Semiconductor Industry at a Young 50

The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over again during SEMICON West 2017 I heard some variation of the phrase “We’re just getting started.” What was it that accounted for the upbeat and buoyant mood at SEMICON West 2017 this month, despite Moscone South Hall being a gaping hole clear down to the basement as a result of Sou... »

Panel Level Packaging: One Size Fits All?

Panel Level Packaging: One Size Fits All?

There is an active and robust supply chain currently supporting these wafer sizes in the semiconductor manufacturing industry: 3”; 4”; 6”; 200mm; 300mm; and 330mm. This wide range of substrates is successfully being used today for “sweet-spot’ manufacturing of LED, compound semiconductor, MEMS, trailing-edge CMOS, leading-edge CMOS, and fan-out wafer level packaging (FOWLP) applications,... »

First-Mover Advantage: Fan-Out Panel Level Packaging at IWLPC 2016

First-Mover Advantage: Fan-Out Panel Level Packaging at IWLPC 2016

“It is better to be first than it is to be better.” (Ries and Trout, in The 22 Immutable Laws of Marketing.) Or is it “Fast Followers Not First Movers Are The Real Winners?” Fan-Out Wafer Level Packaging has built up such a head of steam this year (see “iPhone 7: Apple Charts a Strategic Course by Selecting TSMC’s inFO Platform”) that backwards reels the mind thinking about what come... »

Discussing Panel Scale Packaging at SEMI’s Northeast Forum

Discussing Panel Scale Packaging at SEMI’s Northeast Forum

SEMI did a great job at SEMICON West 2016 organizing a bursting-at-the-seams amount of technical content presented on the show floor, content that included (pleasant surprise) a full track devoted to advanced packaging topics. Definitely not business as usual. The distinction between where fab processes end and where packaging processes begin is blending more and more, thanks to trends like More t... »

Fraunhofer IZM Panel Level Packaging Consortium Launches in Berlin

Fraunhofer IZM Panel Level Packaging Consortium Launches in Berlin

In the bric-à-brac collection that seems to form my particular set of memories and mental associations, I have at least two old somethings crowded in a Berlin corner that I have been looking after for years, a corner to which I have now recently added something new and exciting. And work related. The two old somethings are the writings of Christopher Isherwood (“The Berlin Stories”) and the m... »