It goes without saying that 2021 was a monumental year for the semiconductor industry, and especially heterogeneous integration. Our industry hit mainstream media like never before, and suddenly the whole world understands the importance of semiconductors in our everyday lives.
At 3D InCites, we spent 2021 covering the topics that meant the most to you, both in our blogs and technical articles, as well as our podcast, which launched in May and has had more than 1800 downloads to date.
Going by our most-read blog posts and most listened to podcast episodes, top of mind for the 3D InCites community was not only how to navigate the chip shortage and supply chain issues amidst explosive demand, but also a growing interest in sustainable semiconductor manufacturing. Onshoring advanced packaging, fan-out packaging, anything surrounding chiplet technology, were also important topics for our readers and listeners.
Additionally, covering “softer” yet equally important topics like recruiting and maintaining the semiconductor workforce, and the importance of diversity, equity, and inclusion (DEI), helped grow our younger readership. With 44% of our readership falling between the ages of 18-34, we are proud to be the go-to resource of important semiconductor information for the rising generation of industry leaders (Figure 1)
The 12 Months of Blogging
It’s a little difficult to list the most-read blogs this year, as how long a blog post has been live can change the statistics. In fact, the top performer is STILL a blog post that was published in 2018 entitled, Hybrid Bonding, from Concept to Commercialization. But we still wanted to see which posts topped the charts: Here are 2021’s Top 5:
- IFTLE 479: ABF Substrate Shortages; Consolidation Continues – Phil Garrou
- IFTLE 454: TSMC Exhibits Packaging Prowess at Virtual ECTC 2020 – Phil Garrou
- Another Microelectronics Crisis? The Automotive Chip Shortage and Supply Chains – Dean Freeman
- How to Create a Vibrant Semiconductor Manufacturing Industry in the United States – Scott Jeweler
- Fan-Out Panel-Level Packaging Takes Off – Evatec AG
We also decided to see which blogs people were most interested in reading each month in 2021:
|January||The Importance of Sustainability in Semiconductor Manufacturing||Dean Freeman|
|February||IFTLE 475: EPTC 2020: IME on Hybrid Bonding Challenges; Latest on Intel||Phil Garrou|
|March||IFTLE 479: ABF Substrate Shortages; Consolidation Continues||Phil Garrou|
|April||The Electronics Supply Chain: Is it Broken?||Françoise von Trapp|
|May||IFTLE 486: Morris Chang Expresses Concerns about TSMC Arizona Facility||Phil Garrou|
|June||IFTLE 487: Yole Développement Reviews the Advanced Packaging Market||Phil Garrou|
|July||IFTLE 491: IBM Simplifies Si Bridge Technology||Phil Garrou|
|August||Sustainability in the Semiconductor Fab and Sub-Fab||Dean Freeman|
|September||IFTLE 496: Intel discusses US Mega-FAB; Google To Build Own ARM-based Processor Chips||Phil Garrou|
|October||Panel Level Packaging Consortium 2.0 Gains Ground||Françoise von Trapp|
|November||Electronics Packaging – From Afterthought to Product Differentiator||Steffen Kröhnert|
Are You Listening?
We launched our podcast in May of 2021, and we’ve dropped 25 episodes so far. While our general cadence is meant to be twice monthly, in November we partnered with SEMICON West to be the Official Podcast of SEMICON West and ramped that up to weekly and then daily podcasts. Here are the five conversations our listeners tuned into most:
- A Conversation About Reshoring Advanced Packaging in the U.S.
- A Conversation about The Importance of Package Design for Chiplet Integration
- A Conversation about Global Fab Expansion and Its Impact on Equipment Suppliers and the Workforce
- Conversations from the IMAPS International Symposium – Part Three
- Conversations from the IMAPS International Symposium – Part One
The Latest Podcast Episodes
We’re looking forward to bringing you lots more great content in 2022! Happy New Year from all of us to all of you! ~ FvT