supply chain

DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain

DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain

This year’s Design Automation Conference (DAC 2018) was held at Moscone West, San Francisco, CA. On three levels, about 175 exhibitors showed their capabilities and discussed market needs. Our industry’s focus on artificial intelligence (AI) and machine learning (ML) solutions were clearly obvious, and I suspect, attracted more young people and a fairly large number of new exhibitors to DAC th... »

SEMI 2020: Transforming for the New Supply Chain

SEMI 2020: Transforming for the New Supply Chain

2015 will be remembered mostly for the ‘wild ride’ that fundamentally changed the industry.  An unprecedented wave of M&A activity swept across the electronics supply chain with scores of transactions and with notable multi-billion dollar companies being absorbed.  As a result, in 2016, we are working within a significantly reshaped supply chain. To support this, we have launched the SEM... »

Making Connections at SEMICON West 2016

Making Connections at SEMICON West 2016

If you attended SEMICON West 2016 last week, you probably noticed that the event is undergoing a metamorphosis. It was hard to miss. The signs were everywhere. Literally: It’s not surprising, since everything about the semiconductor manufacturing industry has been evolving over the past few years, and everyone, including SEMI, is feeling the impact. As Karen Savala, President, SEMI Americas, exp... »

HBM Supply Chain Seminar Highlights System-level Advantages

HBM Supply Chain Seminar Highlights System-level Advantages

The Computer History Museum in Mountain View is a very impressive place to show you the enormous progress ICs and Electronic Systems have made in the most recent 50+ years. What I like even more is the fact that an increasing number of high-tech companies and industry organizations are utilizing this great facility for charting our future path on the innovation curve with exhibitions, seminars, wo... »

The More-than-Moore Supply Chain Dream has Become a Reality

The More-than-Moore Supply Chain Dream has Become a Reality

The “More than Moore” revolution has already happened. Semiconductor manufacturing processes are no longer exclusive to the integrated circuit (IC) industry. Today, LEDs, MEMS, and power devices have all integrated semiconductor manufacturing processes. But what is the status of the More-than-Moore supply chain? Yole Développement (Yole) and Serma Technologies (Serma) have partnered to create... »

How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure

How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure

At the 2015 3D InCites Awards Breakfast, which took place July 16, 2015 at the Impress Lounge during SEMICON West, Scott Jones, Director, Alix Partners presented a talk in which he described the positive financial impact interposer and 3D integration will have on the semiconductor manufacturing supply chain. He suggested we think like a fab owner when considering the benefits of implementing in... »

Executive Viewpoint: Providing A Golden Boat of Wafers

Executive Viewpoint: Providing A Golden Boat of Wafers

As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume manufacturing challenges so that ultimately, these technologies can be used in consumer products. Cost is king, and industry-wide efforts are focused on lowering it. We talk a lot about optimizing technology on 3D InCites, but we don’t often look at what can be don... »

Executive Viewpoint: Executing a 3D Supply Chain eSilicon Style

Executive Viewpoint: Executing a 3D Supply Chain eSilicon Style

While the traditional foundry/OSAT supply chain has worked for fabless semiconductor manufactures engaging in the manufacture, package, and test of 2D architectures, it’s well understood that a 3D supply chain requires something different. 3D architectures bring new issues to the table such as yield management, sourcing from different suppliers, who tests what, who owns what, how do you make s... »

2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure

2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure

SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on ensuring that all pieces of the 3D IC puzzle are in place. This was evident from the range of presenters they had lined up during this year’s Technology Forum, held at the The St. Regis San Francisco, 125 3rd St, San Francisco, as part of the company’s SE... »

3D IC Business Model: A Customer Decision

3D IC Business Model: A Customer Decision

After more than a year of touting the turnkey model, even TSMC is jumping on board the collaboration bandwagon for manufacturing 2.5D and 3D ICs at high volume. This revelation came this week at ECTC 2013 (May 28-31, Las Vegas) from TSMC’s Jerry Tzou, who was a panelist during the special session, “The Role of Wafer Foundries in Next –Gen Packaging.” Chaired by Sam Karikalan, Broadcom, the... »

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