At the recent ECTC conference in Dallas, IBM and DECA announced the signing of an agreement to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Canada. Under this agreement, IBM will establish a high-volume manufacturing line focused on Deca’s M-Series Fan-out Interposer Technology (MFIT).
This program is based on IBM’s desire to develop its Bromont advanced packaging capabilities. IBM ‘s plant in Bromont is one of North America’s largest semiconductor assembly and test sites and has been manufacturing advanced packaging for over 50 years. IBM Bromont reports that technologies like MFIT are essential for AI, HPC, and data center applications.
Scott Sikorski, Head of Business Development for Chiplets & Advanced Packaging at IBM noted that “Advanced packaging and chiplet technology are critical for faster, more efficient computing solutions in the age of AI. Deca will help ensure IBM’s Bromont facility remains at the forefront of these innovations….”
Deca’s M-Series platform is the highest-volume fan-out packaging technology in the world, with over 7B M-Series units shipped. MFIT builds on this proven foundation by integrating embedded bridge die for chips’ last processor and memory integration delivering high-density, low-latency connections between chiplets. MFIT seeks to provide a cost-effective alternative to full silicon interposers for ever-larger AI, HPC, and data center devices.
In the spring of 2016, DECA and ASE signed an agreement whereby ASE invested $60MM in Deca and licensed Deca’s M-Series Fan-out Wafer-Level Packaging (FOWLP) technologies and processes. As part of the agreement, ASE and Deca jointly develop the M-Series fan-out manufacturing process at ASE sites in Taiwan.
In October of 2021 SkyWater and Deca announced an agreement for Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning to be used at SkyWater’s advanced packaging facility in Florida.
In January of 2024, SkyWater and Deca announced receipt of a $120M DOD (IBAS) Award to expand advanced packaging capabilities in Osceola County, Florida, which would make SkyWater the first domestic provider of Deca’s M-Series fan-out and Adaptive Patterning technologies in support of the reshoring of the semiconductor supply chain.
With an expected value of $120 million over five years, the award includes options for an additional $70 million, for a total value of up to $190 million. SkyWater was the first domestic licensee of Deca’s M-Series and Adaptive Patterning solutions. The award is part of the DOD’s Office of the Secretary of Defense (OSD’s) Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) efforts.
In Nov of 2024 CHIPS National Advanced Packaging Manufacturing Program (NAPMP) awarded $100 million to Arizona State University and Deca Technologies for the SHIELD USA initiative.
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