Fan-out panel level production is underway at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications. The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC. Future applications under consideration for panel production include application processors, memory and RF modules. TechSearch International, Inc. details these applications and analyzes monthly panel requirements and planned capacity. Supplier plans are discussed and consortia activities are highlighted.
One of the major market trends in wearable electronics is the shift to smartwatches, which have surpassed shipment numbers for wristbands. Package trends for wearable electronic products are analyzed, including Apple’s new smartwatch using TSMC’s InFO and Samsung’s Galaxy using FOPLP. The latest trends in augmented reality (AR) and virtual reality (VR) headsets are discussed. A detailed analysis of the change in packages from the previous generation HTC Vive VR system is presented.
A detailed analysis of the OSAT financials is provided with regional growth documented. Board and substrate material requirements for 5G applications are presented.
The latest Advanced Packaging Update is a 45-page report with full references and an accompanying set of 46 PowerPoint slides.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on twitter @Jan_TechSearch