Latest Posts - Page 5
IFTLE 566: NGMM Teams Chosen; TSMC Delays US Fab Opening; Japan’s Rapidus; Lewis to Lead NSTC
DARPA Chooses 11 teams to kick off NGMM DARPA has selected 11 organizations to begin work on the Next-Generation Microelectronics...
TechSearch International, Inc. Examines Advanced Packaging’s Growth in AI
Advanced Packaging’s Growth in AI TechSearch International’s latest analysis examines the demand for packages used in AI. As the industry...
IFTLE 563: Is CoWoS Capacity Causing a GPU Shortage?
Semi Analysis has detailed their thoughts on the current GPU shortage. We all know that AI technology is upon us....IFTLE 561: Hybrid Bonding (HB) Update from Besi and EV Group
Sorry for the disruption of the chronological flow of my recent blogs, but before I move on to the July...
IFTLE 560: Emerald Rapids – Is Intel Backing off on Chiplets?
A recent report by Semi Analysis (SA) notes that Intel has backed off on the use of chiplets in its...
Lam Research Introduces World’s First Bevel Deposition Solution to Increase Yield in Chip Production
Coronus® DX builds on Lam’s 15-year heritage of innovation in bevel solutions FREMONT, Calif., June 20, 2023 /PRNewswire/ — Lam...73rd ECTC: New Format, New Venue, Amazing Experience!
Preparation for the 73rd ECTC started one year ago and was strongly supported by over 250 experts from 15 countries,...
Amkor Advanced Packaging Enables the Car of the Future
TEMPE, Ariz.–Jun. 13, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the...
The Alphabet Soup of 3D Packaging
More than a few years ago, somewhere around 28nm, my working group was discussing the potential demise of “Moore’s Law”....
ECTC 2023: Quantum Computing, Hybrid Bonding, and the CHIPS for America Act
With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb...TechSearch International Releases Market Forecast for BGAs and CSPs
Market Forecast Reveals the Downside of the Covid Spending Spree in Electronics, Provides an Update on Build-up Substrate Supply and...
A Look at the Next Generation of Packaging Inspection Solutions
With the increasing expectations and demands of customers of electronic equipment, the manufacturing technologies applied are also propelled due to...
Breaking the Limits: StratEdge Pushes High-Temperature Packaging Technology to the Extreme at Upcoming Events
Santee, Calif. – 14 April 2023 – StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages...
Excitement Over Chiplets: Not for Everyone and Not Trivial for Test
Live from “Silicon Desert”: The news is all about huge spending by TSMC and Intel. Investment in advanced packaging (2.3/2.5/3D...
Plan Optik and 4JET Jointly Develop New Process for Advanced Packaging
• Process innovation for through-glass vias in the field of advanced packaging • Premiere at Touch Taiwan on April 19-21...
IFTLE 552: CHIPS Industrial Advisory Council (IAC) Update
CHIPS Announces Details on Funding Opportunity Timing The Department of Commerce (DoC) has announced details regarding funding opportunities and application...
QP Technologies New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its...
IFTLE 549: Penn State CHIMES In
As IFTLE has been reporting for the past few months, monies continue to be poured into the onshore advanced packaging...
