Latest Posts - Page 2
The Intel Developer Forum 2014
This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I have...
Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder
Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate...
Will 2.5D and 3D Stacking Save the Semiconductor Industry?
Year’s ago, when I was managing editor of Advanced Packaging Magazine, each January issue featured an industry forecast cover story....
SEMICON West 2014: Are 3D ICs Getting the Squeeze?
With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm...
Should EDA vendors, OSATS, and their customers cooperate more?
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent...
Making Progress with 3D IC Design and Test
Thank you, Ann Steffora Mutschler (Semiconductor Engineering) for getting to the bottom of the difference of EDA tools for 2.5D...
Magic Chip-powered SuperPoP offers Near-term Alternative to TSVs
When I saw that Dev Gupta, Ph.D, of Advanced Packaging & Systems Technology Laboratories, LLC (APSTL) was presenting at the... SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers
Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and...
2.5D and 3D IC Technologies: Application Ready but Cost Limited?
Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and...
The 2014 European 3D TSV Summit: Get Ready for the Domino Effect
I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21...
Launching a Trillion Sensors on a Sea of Through Silicon Vias
To the readers of 3D InCites: Happy New Year! I hope your 2014 will be a healthy and prosperous one...
READY – AIM – FIRE! Predictions for 2.5D ICs in 2014
Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so... Successful 2.5D Test Vehicle Project Launched by GLOBALFOUNDRIES, Open-Silicon and Amkor Technology
GLOBALFOUNDRIES has unveiled details of a 2.5D test vehicle project that demonstrates the value of its open and collaborative approach... Triton Microtechnologies Receives Funding to Ramp Glass Interposer Manufacturing for 3D and 2.5D Semiconductor Packaging
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month...
Catching Up with Dongkai Shangguan about NCAP China
If you have an ear out for the new in the world of 3D IC technology as I do, then you... Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials...
Shaping the Future of MEMS, Sensors, and 3D IC: Fertile Grounds for Collaboration
STMicroelectronics brought a “Who’s Who” of thought leaders from across the MEMS and Sensors ecosystem to Santa Clara, CA, on... Rudolph Announces New Metrology Suite for Advanced Packaging
New NSX Metrology Series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC Rudolph...
