2.5D

Opportunities for 2.5D and 3D Cost Reduction

Opportunities for 2.5D and 3D Cost Reduction

A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I am again to tackle the issue of 2.5D and 3D cost reduction from a slightly different angle. This entry is based on what SavanSys presented at IMAPS Device Packaging 2016. The previous Knowledge Portal entry spent time discussing cost drivers; a few specific numbers were provided, but overall, the details we... »

A Perfect Storm is Brewing for Complex Packaging in 2016

A Perfect Storm is Brewing for Complex Packaging in 2016

If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for complex packaging (2.5/3D). But this conference showed that companies and their development organizations are NOT solely looking towards FinFETS and sub 20nm silicon process nodes to meet their integration, power, speed, weight, etc metrics.   We are in the perfect storm: out of control costs a... »

Rudolph Acquires Inspection Technology  of Stella Alliance, LLC

Rudolph Acquires Inspection Technology of Stella Alliance, LLC

Flanders, New Jersey (September 29, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a Massachusetts-based semiconductor inspection technology intellectual property (IP) portfolio company. Stella Alliance’s patented illumination, auto-focus and image acquisition technology significantly enhances the ability to identify certain critical d... »

Tessera to Acquire Ziptronix, Inc. for $39 Million

Tessera to Acquire Ziptronix, Inc. for $39 Million

SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash. The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D IC solutions to semiconductor industry customers. Ziptronix’s patented ZiBond... »

Silicon Photonics and 2.5D Interposer Design

Silicon Photonics and 2.5D Interposer Design

Historically, we all took Moore’s Law for granted. With each new node, we could expect to see faster-performing devices, smaller design footprints and, ultimately, lower design costs. Nowadays these benefits are not clearly achievable for all designers. At the latest advanced technology nodes, we may be able to see faster devices through the miracles of finFET technologies, but do we really get ... »

GIT 2014: “Call them Interposers, as God Intended”

GIT 2014: “Call them Interposers, as God Intended”

Subu: “I find the whole concept of 2.5D fairly atrocious. I have banned its use.” Rao: “what are you going to call it?” Subu: “Interposers, like God intended it to be.” The exchange quoted above took place between Subramanian Iyer, PhD, Director, Systems Scaling Technology IBM, and co-chair of this year’s Global Interposer Technology Workshop (GIT2014), and ... »

GLOBALFOUNDRIES has its 3D Ducks in a Row

GLOBALFOUNDRIES has its 3D Ducks in a Row

The news about 3D readiness just keeps getting better. Last week I tuned into a GLOBALFOUNDRIES webcast, featuring speaker Rama Alapati, Director Packaging Engineering, GLOBALFOUNDRIES. Alapati spoke for an hour about the companies’ approach to interposer and 3D integration technologies, and how the open innovation approach has allowed them to develop the critical partnerships with EDA vendors, ... »

The Intel Developer Forum 2014

The Intel Developer Forum 2014

This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I have become more energy-conscious, so took the train to get there and back. On my way back I didn’t have to concentrate on the traffic around me and had time to think about what I learned from Intel’s keynotes and Mega-sessions on the first day. For many years, Intel has been the world’s largest... »

Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder

Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder

Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate (C2S) bonder that answers today’s thermo-compression bonding challenges. The APAMA was designed with performance and accuracy in mind, delivering the best-in-class die-stacking solution for 2.5D / 3D or TSV integrated chips. The key hi... »

Will 2.5D and 3D Stacking Save the Semiconductor Industry?

Will 2.5D and 3D Stacking Save the Semiconductor Industry?

Year’s ago, when I was managing editor of Advanced Packaging Magazine, each January issue featured an industry forecast cover story. For several years in a row, that issue predicted advanced packaging would be the key to improved performance at lower power and lower cost. January of 2007, we declared “Packaging Saves the World!” and in January of 2008, the cover story was “Packaging Drive... »

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