2.5D

SEMICON West 2014: Are 3D ICs Getting the Squeeze?

SEMICON West 2014: Are 3D ICs Getting the Squeeze?

With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm nodes already qualified without TSVs, making us wait until 10nm, are 3D ICs suddenly getting the squeeze from both sides? That’s one theory I took away from all the conversations and presentations at this year’s SEMICON West 2014, which took place July 7-10, 2014 a... »

Should EDA vendors, OSATS, and their customers cooperate more?

Should EDA vendors, OSATS, and their customers cooperate more?

Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »

Making Progress with 3D IC Design and Test

Making Progress with 3D IC Design and Test

Thank you, Ann Steffora Mutschler (Semiconductor Engineering) for getting to the bottom of the difference of EDA tools for  2.5D and 3D IC design and test, and providing such a clear explanation in your post, “Evolution vs. Revolution”. In this 2-part post, Mutschler explores the EDA vendor arguments that “tool and design flow changes need to be evolutionary, rather than revolutionary.” A... »

Magic Chip-powered SuperPoP offers Near-term Alternative to TSVs

Magic Chip-powered SuperPoP offers Near-term Alternative to TSVs

When I saw that Dev Gupta, Ph.D, of Advanced Packaging & Systems Technology Laboratories, LLC (APSTL) was presenting at the IMAPS Arizona Chapter luncheon last week, there was no questioning my attendance. Dr. Gupta has been an active participant on 3D InCites, offering regular commentary on posts, so I was particularly eager to hear and report on what he had to say on his chosen topic of the ... »

SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers

SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers

Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of its ELP300 Gen2. This latest generation of excimer laser steppers provides a means to directly create vias (< 5µm) and microstructures, addressing the limitations of traditional photo-dielectrics and photolithography st... »

2.5D and 3D IC Technologies: Application Ready but Cost Limited?

2.5D and 3D IC Technologies: Application Ready but Cost Limited?

Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and 21, 2014 at Minatec campus in Grenoble France. One I addressed in yesterday’s post – about realizing system-level benefits – including cost – by integrating 2.5D and 3D IC technologies. The other big question mark, as we all know, is how to reduce the cost-of-ownership of thes... »

The 2014 European 3D TSV Summit:  Get Ready for the Domino Effect

The 2014 European 3D TSV Summit: Get Ready for the Domino Effect

I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21 countries, 24 presentations, 3 keynote speakers, 2 panel discussions, several face-to-face interviews and lots of side conversation all about 3D TSVS being Application Ready leads to a good deal of information to process and write about. So let me start off with some key take-aways and ... »

Launching a Trillion Sensors on a Sea of Through Silicon Vias

Launching a Trillion Sensors on a Sea of Through Silicon Vias

To the readers of 3D InCites: Happy New Year! I hope your 2014 will be a healthy and prosperous one for you and for your families, and I hope you will continue following 3D InCites (and maybe even be contributing yourselves) as the year progresses. Now that the Internet of Things (IoT) technology meme is in the “Peak of Inflated Expectations” phase of the Gartner Hype Cycle Curve, and with the... »

READY – AIM – FIRE! Predictions for 2.5D ICs in 2014

READY – AIM – FIRE! Predictions for 2.5D ICs in 2014

Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so far, economics have discouraged them from starting volume production. Ho-Ming Tong, CTO, ASE, and his team realized a few years ago that vertical stacking of logic die and/or heterogeneous functions did (and still do) require major engineering efforts and significant business model changes befo... »

Successful 2.5D Test Vehicle Project Launched by GLOBALFOUNDRIES, Open-Silicon and Amkor Technology

Successful 2.5D Test Vehicle Project Launched by GLOBALFOUNDRIES, Open-Silicon and Amkor Technology

GLOBALFOUNDRIES has unveiled details of a 2.5D test vehicle project that demonstrates the value of its open and collaborative approach to delivering next-generation chip packaging technologies. The company, in partnership with Open-Silicon (chief architect) and Amkor Technology, Inc. (assembly and test), jointly exhibited a functional system-on-chip (SoC) solution featuring two 28nm logic chips, w... »

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