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Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference (ECTC) in Orlando. I have counted 24 companies with booths, and even more presenting papers. It’s going to be the best three days in packaging, components, and microelectronic systems science,...
Fan out (FO) packaging is one of the key growth segments in advanced packaging, with high adoption rates and strong technology advantages offering a strong pathway moving forward to support industry roadmaps. The nature of reconstituted substrates is now enabling fan-out panel-level packaging. Fan out packaging is no longer limited...
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next killer application?...
More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer markets as smartphones, tablets and many handheld devices require advanced features in light and thin products. Currently, those requirements are being fulfilled by fan-in or...
Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced packaging. One thing that I’ve heard over the past year is that as 3D technologies move into manufacturing, it’s become difficult to recruit speakers who have fresh content. Notoriously slow...
Fan-in packaging has been a successful and steadily growing platform for over a decade. However, fan-in packaging should face a challenging future, announces Yole Développement (Yole), the “More than Moore” market research and strategy consulting company. Indeed, despite unchanged market drivers, Fan-In packaging is showing an uncertain future with a...
NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced that it has received an order from NANIUM, S.A., a Portugal-based semiconductor manufacturing, test and engineering services provider, for a 300mm Sigma fxP...
Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel fan-out manufacturing line. The JetStep S Series Lithography System was selected after a thorough evaluation...
Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference in Orlando. Once again, this year’s event offered a wide range of topics in six tracks. I spent most of my time in the “Advanced Packaging” track and was in...
I took a detour to work on Friday (Oct 18, 2013), stopping in at Freescale Semiconductor (Tempe AZ) to attend the Arizona SEMI Breakfast Forum. The topic was right up my alley: (which is why I went, of course!) “New Advanced Packaging Insights on Technology and Applications“. Featured speakers included...
