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Continuing our look at presentations at the 2022 ECTC, who better to examine the question “Panel Level Packaging – Where are the Technology Limits?” than Tanja Braun and the group at IZM Fraunhofer who have become experts in this processing area over the last several years? Although they do not...
Electronics Packaging vs. Advanced Packaging Electronics packaging is generally divided into three major areas, traditional packaging – also called standard or mainstream packaging, and sometimes even just “Others”: advanced packaging and emerging packaging technologies. Traditional packaging is everything with wire or ribbon bond interconnects on a ceramic, metal lead frame,...
ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is taking the first ever step towards developing the new generation of thermal debonding and warpage adjustment tools for fan-out panel level packaging (FOPLP). The new ERS MPDM700 supports the increasing demand for fast prototyping...
It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has shifted to advanced packaging and heterogeneous integration to meet demands for microelectronics devices targeting the internet of things (IoT) market. These devices perform a variety...
Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had...
The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney World Swan and Dolphin Resort. The buzz started during the Tuesday evening plenary session, where panelists Douglas Yu, TSMC,...
The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a theme of “Bridging the Interconnect Gap”, as the industry faces new challenges due to the onslaught of Big Data brought about by the Internet of Things (IoT). To provide vision...
For many years now, the semiconductor industry development has been governed by Moore’s law and the increasing demand for higher performance and lower manufacturing costs. Under this context, the “More than Moore” company, Yole Développement (Yole) has identified a strong interest for panel-level packaging technologies. “At Yole, we saw a...
No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with suppliers. I stopped in to see several semiconductor supplier companies who annually request an audience with the Queen of 3D to talk about their latest accomplishments, as well as gain...
I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my personal vacation to India to attend my 40th high school reunion and 35th college reunion – two weeks tops. It escalated quickly. It ended up being 34 day, 20 city,...
