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As the power density increases for semiconductor devices, thermal management is becoming an ever more critical challenge for reliability and performance, for high-performance computing, AI, data center, power electronics, and other applications. Heat dissipation is often a great concern as the junction temperature rises with an increased power density, which...
Perhaps more than at any point in the history of the semiconductor industry, the manufacturing and design supply chain is in the world’s spotlight, thanks largely to the recent period of international trade tension. The national agendas of governments representing the world’s largest economies are prioritizing IP protection along with...
This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at Intel Germany discussed their “product-on-board” reliability test for 0.3mm WLCSPs. The existing JEDEC/IPC board-level methodology tests are fine for traditional packaging solutions for non-extreme low K dielectric (ELK) fab nodes....
Join us in Milan, Italy, on September 17 and 18, 2015 for a new flagship MEMS event being produced by SEMI Europe. The SEMI European MEMS Summit 2015 expands on SEMI’s long record serving the MEMS device fabrication manufacturing supply chain and, combined with SEMI’s proven track record in microelectronics overall, the...
