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Ultra Fn A Furnace Tool Shipped to China-Based Foundry Customer FREMONT, Calif., Sept. 27, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace...
Here at Siemens EDA, we expect to see greater emphasis in several areas of semiconductor package design as we head into 2022. To start, heterogeneous integration (HI) of multiple dies into system-in-packages (SiPs) will be common across all market segments and will use multiple integration platforms, not just silicon interposers,...
When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fall because that’s a time when more new IC projects are being planned. After many years of...
Last week, I had a whirlwind trip to Grenoble, France: 3 days, 2 summits, and 1 supercool paragliding festival, Coupe Icare, on the side – all filled with “Aha!” moments. Ironically, the paragliding event I attended on Saturday drove home the point of the most stand-out talk from the week:...
Join us in Milan, Italy, on September 17 and 18, 2015 for a new flagship MEMS event being produced by SEMI Europe. The SEMI European MEMS Summit 2015 expands on SEMI’s long record serving the MEMS device fabrication manufacturing supply chain and, combined with SEMI’s proven track record in microelectronics overall, the...
Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual two and a half days, this year it spanned 3 days, because it also offered a 4-hour session about 3D design challenges and solutions available from foundries, EDA and IP...
In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the most highly industrialized countries in the world. But some how it has managed to keep its Alpine charm. That’s why at first glance, the city of Balzers, complete with its...
The technologies are ready, the target high volume applications for 3D IC manufacturing have been identified, and now it’s about convincing system architects there’s more to gain from designing in 2.5D and 3D ICs than there is to lose. At last week’s European 3D TSV Summit (January 21-22), two European...
While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged on with its original annual Viewpoints series right up until last week. I spent some time pouring over the musings of industry executives’ contributions. Many discuss the proliferation of mobile...
In an understated research lab and recently upgraded demo facility located just outside Paris in Massy, France, Alchimer scientists are working diligently to prove the readiness of an elegant and innovative electrochemical-based process for the growth of nanometric thin films of various types on both conducting and semiconducting surfaces....
