Matches for your search: "fan-out wafer level packaging "
While critical to the processes, molding and encapsulation materials used in both fan-in and fan-out wafer-level packages (FI WLP/FO WLP) can lead to high wafer warpage after molding, which may ultimately lead to downstream wafer handling issues. Additionally, many of these materials contain certain anhydrides that are banned under the...
Virtual IWLPC kicks off on October 13, 2020, and 3D InCites community members will be well represented, from the panel discussion to the exhibit hall, to the program. The Virtual IWLPC panel discussion titled “Meeting Future Advanced Packaging Challenges: What’s Next?” will commence on Wednesday, October 14, 2020, at 9:00...
When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level Packaging Technology, I was a little apprehensive. I reminded them that I was NOT an engineer, so would only be able to review it from the layperson’s perspective. They assured...
Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,” written by Amy Lujan, of Savansys. Lujan did a very good analysis on the cost comparison of fan-out wafer-level packaging (FOWLP) with chip-first and die...
As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it, however, most of them don’t know what they are talking about. Let’s use the chips first, face-up fan-out wafer level packaging (FOWLP) approach as an example. Also, let’s consider three redistribution...
In recent years, there has been an increased focus on fan-out wafer level packaging. While fan-out wafer level packaging may be the right solution for some designs, it is not always the lowest cost solution. Flip chip packaging, a more mature technology, continues to be an alternative to fan-out wafer...
I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential nature or meaning of something.” In FvT’s piece “Spotlight on FOWLP, Monolithic 3D IC, and 3D TSVs,” (13 May 2015) I am quoted saying: “Show me where monolithic or FOWLP...
Wilmington, Mass. (June 28, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide, announced today that a leading OSAT in Asia has placed an order for over $11...
Sadly, this year it was the 3D session track that had lots of empty seats at the 2015 International Wafer Level Packaging Conference (IWLPC 2015), which was a bit surprising since 3D is really hitting its stride with so many products in high performance computing on the market. Next door,...
Flanders, New Jersey (April 27, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity expansion. The tools, which...
