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IMAPS San Diego Community Member Preview

The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This year’s symposium will feature five technical tracks, professional development courses and an interactive poster session. The technical program spans three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel...

2023 ECTC Community Member Preview

Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference (ECTC) in Orlando. I have counted 24 companies with booths, and even more presenting papers. It’s going to be the best three days in packaging, components, and microelectronic systems science,...

Fan-out Panel-level Packaging Comes to the ECTC Technology Corner

On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became clear by the number of exhibitors displaying their product samples, that one of my blogs would be an update on fan-out panel-level packaging. For the...

Fan-out is the Most Dynamic IP Landscape in Advanced Packaging

In the fast-growing fan-out market showing 80% increase between 2015 and 2017[1], it is today essential to deeply understand the patent strategies of the key players. The Technology Intelligence & Intellectual Property (IP) Strategy Company, KnowMade has thoroughly investigated the fan-out packaging patent landscape and releases today the new patent...

Will Fan-out Packaging be Sustainable Long-term?

2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of fan-out packages. Yole Développement (Yole) is analyzing the current market and technologies trends and offers you to discover these results within a new...

Panel-level Packaging: a Promising Market

 For many years now, the semiconductor industry development has been governed by  Moore’s law and the increasing demand for higher performance and lower manufacturing costs. Under this context, the “More than Moore” company, Yole Développement (Yole) has identified a strong interest for panel-level packaging technologies. “At Yole, we saw a...