High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect...
Advanced packaging, and particularly 3D through silicon via (TSV) integration technologies and the resulting 3D-stacked products, challenge materials and process...
“How is heterogeneous 3D integration defined?” There are certainly different understandings in the microelectronics community regarding the definition of heterogenous...