Book Review: Handbook of 3D Integration – Volume 4 Jun 11, 2019 · By Herb Reiter · Book Reviews, Resource Library
Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing May 21, 2019 · By Francoise von Trapp · Book Reviews, Resource Library
The 5G Revolution is Pushing Innovations for RF front-end SiP Mar 27, 2019 · By Yole Development · Resource Library
3D IC System Verification Methodology: Solutions and ChallengesJun 01, 2013 · By Francoise von TrappBy Dusan Petranovic, Member, IEEE, and, Karen Chow, Member, IEEE, (Mentor Graphics) The three largest EDA companies are taking an...
A Comparative Simulation Study of 3D TSS Assembly ProcessesJun 01, 2013 · By Kamal KarimanalA memory stack on logic 3D TSS stack was considered for comparative study of warpage response to two different process...
Scaling 100G Wired Applications with Heterogeneous 3D FPGAsJun 01, 2013 · By Francoise von TrappBy: Ehab Mohsen, Xilinx To address the insatiable demand for bandwidth, the communications industry is accelerating development of Nx100G line...
The 3D Standards DashboardDec 04, 2012 · By Francoise von TrappAs the 3D standards initiative continues to gain traction within a number of participating organizations including SEMI, SEMATECH, JEDEC, IEEE,...