Sustainability 101: Refuse, Reduce, Repair, Refurbish, Rework
Apr 16, 2024 · By Julia Freer Goldstein · Blogs, From Different Dimensions
Latest Posts - Page 15
3D NAND Flash – Schiltron’s Answer
It probably appears that the only 3D technologies vying for 2D NAND’s crown are V-NAND from Samsung and p-BiCS from...
Samsung’s V-NAND Flash at the 2014 ISSCC: Ye Distant Spires…
True to form, Samsung followed up it’s V-NAND Flash announcement of 2013 with a product chip-level presentation at the 2014 IEEE International Solid-State...
Wafer Level Packaging and Stacking take Center Stage at Asia Conferences
I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my...
Launching a Trillion Sensors on a Sea of Through Silicon Vias
To the readers of 3D InCites: Happy New Year! I hope your 2014 will be a healthy and prosperous one...
3D Wafer Level Packaging: Outlook for 2014
In 2013, SPTS equipment sales into the advanced packaging market grew by 75%. Some of this was due to a...
3D IC Implementation: Outlook for 2014
Mobile/smart devices will continue to drive innovation and volumes in the semiconductor industry in 2014. The much discussed “Internet of...
3D TSV Test Approaches: Outlook for 2014
Metrology, process control, and electrical test are key enablers for the success of the semiconductor industry. 3D integration using TSVs...
3D IC Design: Outlook for 2014
To date we at Mentor Graphics have seen a handful of 3D IC design releases, and even more customer evaluations....
Improving Yield and Reducing Cost of 3D TSVs: Outlook for 2014
At Alchimer, we believe that as it becomes technically more difficult to shrink to further nodes, companies will turn to...
3D NAND Flash: Outlook for 2014
What with all the commotion about 3D NAND and the accompanying cyberspace chorus, you would surely be forgiven in thinking...
3D NAND Flash – Towering Spires or Costly Canyons? – Part 4
If you’ve followed me thus far in the three preceding posts, well done! We started by questioning the cost assumptions....
Catching up with Sand 9 at the MEMS Executive Congress 2013
Sometimes 3D IC/TSV news comes in with a splash on the front page of the morning paper, maybe somewhere above...
3D TSV without Limits
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
Part 3: 3D NAND Flash – Towering Spires or Costly Canyons?
As promised in Part 2 of this series, in this third installment, I’ll continue to wade into the choppy waters...
GIT 2013: One Silicon Guy’s Perspective
A 3D conference (or 2.5D workshop) wouldn’t be a 3D conference (or 2.5D workshop) without someone announcing the push-out of...
Notes from GIT 2013
The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
Catching Up With Steve Breit, Coventor, at the TSensors Summit
A journey of a trillion sensors begins with a single step. The TSensors Summit, held at Stanford University on 23...
Part 2: 3D NAND Flash: Towering Spires or Costly Canyons?
In my last blog posting I went over the cost aspects of the Samsung-Toshiba 3D NAND approaches. The conclusion is...
IMAPS International 2013 3D Technology Highlights
Approximately 880 people registered for IMAPS International 2013, and yes the fiasco in Washington even affected IMAPS – there were...
