Ramachandran Trichur, Author at 3D InCites

About Ramachandran Trichur

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2018 Outlook for Advanced Packaging Materials

2018 Outlook for Advanced Packaging Materials

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by the need to deliver highly int... »