From Classroom to Career: Building the Next Generation of Microelectronic Talent
Mar 26, 2026 · By Camden McCrea · Blogs, From Different Dimensions
Latest Posts - Page 13
Temporary Wafer Bonding System Is Based On Electrostatics, Not Adhesives
Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes...
Chiplets: The New Era Begins
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important....
Chiplets Promise to put Moore’s Law Back on Track
Moore’s Law may not be dead, but at 55 years old, it’s certainly feeling its age, with the pace of...
Commerce Department Tightens the Screws on the US Semiconductor Industry
On April 28, the commerce department issued the following news release that could deeply impact the US semiconductor industry: “The...
SemiSister Success Story: A Woman on the Edge of 3D Technology
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first...
Six Ways to Repurpose Your Tradeshow Investment
Like all global industries, the tech industry is being challenged in unprecedented ways as the outbreak of the novel coronavirus...
Recent Achievements in SEMI Standards
The first SEMI Standards Committee was formed in 1973 to address silicon wafer dimensional specifications. At the time, there was...
Diversity, Parity, Prosperity: Perspective of an Industry Veteran
“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1...
Semiconductor Industry Collaboration Becomes More Critical as Technologies Converge
Perhaps more than at any point in the history of the semiconductor industry, the manufacturing and design supply chain is...
COVID-19 and Semiconductor Recovery: What Does the Future Hold?
While the fog surrounding COVID-19 is still heavy out there, over the past week it has started to clear enough...
The More Things Change, The More They Stay The Same
By David Francis; Director of Product Management, Cimetrix In the early 1990’s I worked with companies like Motorola, Wacker Siltronics,...
COVID-19: What Can We Learn from China’s Experience?
Across the world, citizens are settling into a temporary new normal necessitated by efforts to slow the spread of the...
Heterogeneous Integration Technologies for Moore’s Law 2.0 and Beyond
Despite travel restrictions due to the Coronavirus, Dr. Douglas Yu, Vice President of R&D for TSMC gave a keynote via...
Why implement a SECS GEM driver?
A SECS GEM driver can be looked at from a factory or equipment supplier perspective. I will discuss both of...
Big Data and Beyond: PTC Summit Examines AI and ML for Smart City Applications
The problem at its most succinct: “A piece of equipment will deteriorate much more predictably than a human body does.”...
Industry Standards Activity Report November 2019
The SEMI North American standards meetings for the Information and Control Committee were held recently and the following is a...
GEM: Meeting Future Needs by Building on the Stability of the Past
As a young boy, I liked to work on the family car with my dad. He taught me how to change...
Successful Growth in 2020 Calls for a Sustainable Approach
On the whole, 2019 was a very interesting year for the global semiconductor industry. After a record-setting 2018, the market...
2020 Outlook: Optimism Ahead! The Opportunities are There
I am writing this viewpoint while 2019 will close in a couple of days. If I try to summarize what...
