SEMICON West Navigates Semiconductor Industry Changes
Nov 18, 2025 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 10
EDPS 2017: NOT the usual Electronic DESIGN Process Symposium
When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold...
TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem
Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara...
IMAPS 2017 SiP Conference Takes on Sonoma
California’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses,...
Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions
I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for...
Mission Impossible? Not for SEMI!
San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at...
DAC 54: From Grey to Colorful and Solutions-minded Messaging
The 54th Design Automation Conference (DAC 54) at the Austin Convention Center was very different, compared to the last several...
Will IoT be the Next Killer App for Semiconductors?
At the end of April, I attended the Internet of Things (IoT) Developers Conference at the Santa Clara Convention Center....
Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA
The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very...
IMAPS DPC 2017 Covers Range of High-tech Topics, Including EDA
The WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took...
Highlights of the 23rd TSMC Symposium
On March 15, 2017, TSMC held its 23rd Symposium, based on popular request, at the Santa Clara Convention Center. I...
13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment
The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest)...
IEDM 2016 Demonstrates Device Physics For The Semiconductor Industry
In the past few months I have been reading a lot of depressing news about our semiconductor industry’s declining growth...
Pasadena offers Roses and Technology
California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It...
TSMC’s OIP Symposium 2016
After a fairly long vacation it’s very hard to get back to work. That’s why I was really glad that...
The Great Divide Between Semiconductor Design and Manufacturing
Shortly before the summer break started, I attended a number of industry conferences: MEPTEC, ECTC, DAC, MEMS & Sensors, ASME...
DAC 2016: There is More to Life than IC Design, Part 2
Part 1 of my DAC 53 reporting focused on this year’s really impressive keynotes, now posted on the DAC website,...
DAC 2016: There is More to Life than IC Design
In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that...
Looking Beyond the Components Horizon at ASME’s IoT Connect.
Every time someone asks me how my years experience I have, I tend to get evasive or try to turn...
Transforming Today’s Semiconductor Industry Challenges into Tomorrow’s Opportunities
My wife, born and raised in Hong Kong, tells me that the Chinese language uses the same word for challenge...
