Taking Stock of Global Investments in Semiconductor Manufacturing
Apr 10, 2024 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 11
Should EDA vendors, OSATS, and their customers cooperate more?
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent...
Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?
Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half...
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
A Sneak Peek at IITC and AMC 2014
The recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double...
When You Come to a Fork In the Road, Take It
When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I...
Breaking Down Walls between Board, Package, and IC Design Steps
Many years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and,...
READY – AIM – FIRE! Predictions for 2.5D ICs in 2014
Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so...
Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013
The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
