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Xilinx: Ultrascale VU440 3D FPGA
The Xilinx Ultrascale VU440 3D FPGA is constructed using “Xinterposer” 3D IC technology jointly developed by Xilinx and TSMC. It...
ECTC 2015: From the Tech Sessions Part 2
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I...
Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the...
Xilinx Ultrascale+: 3D on Steroids
Ever since 3D transistors (aka FinFETS or Intel’s Tri Gate) 3D NAND, and monolithic 3D IC processes joined the family...
3D ICs for High Performance Systems
A recent IEEC and IEEE CPMT workshop held on October 16, 2013 at Binghamton University in New York examined the...
And a Good Time was had by All – 3D InCites Awards Breakfast, 2013
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge...
Momentum Builds for the 2013 3D InCites Awards
Subscribers are practically blowing up 3D InCites as they duke it out online and race the July 3rd deadline for...
Xilinx: Virtex-7 H580T
Product Description The Virtex-7 H580T FPGA is the first 3D heterogeneous all programmable device, featuring up to eight 28 Gbps...
Scaling 100G Wired Applications with Heterogeneous 3D FPGAs
By: Ehab Mohsen, Xilinx To address the insatiable demand for bandwidth, the communications industry is accelerating development of Nx100G line...
European 3D TSV Summit: 3D TSVs Come of Age
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
Tying up 2012 3D IC Loose Ends
I don’t know about you, but I always find that amidst the holiday hubbub, the really important stuff gets shoved...
3D ASIP 2012: Damn the Torpedos! Full Speed Ahead!
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear...2.5D and 3D FPGA Update
Ever since TSMCs Open Innovation Platform (OIP) event, we’ve been hearing all about how the company has qualified its 2.5D...SEMICON Taiwan’s 3D Tech Forum: Were You There?
I didn’t make it to the SEMICON Taiwan SiP Global Summit this year and was hoping to find some coverage...The Stacked Die Reality Check Continues; FPGAs Lead the 3D Charge
It’s been one of those Mondays. I started making the coffee this morning (put in a clean filter, poured in...SEMICON West 3D (and more) Mash-up
Now that I’ve finished (finally) writing and posting all 3D InCites original content, I thought I’d take a look around...2.5D and 3D Messages Worth Repeating
I listened in on yesterday’s webcast, 3D and 2.5D Integration: A Status Report Live Event hosted by Solid State Technology,...Inspiring the Semi Industry’s New Frontier
Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss...