Latest Posts
Packaging the Future of AI – Key Themes from the IMAPS Device Packaging Conference
This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted...Backyard Olympics returns to Device Packaging 2026
The IMAPS 3D InCites Backyard Olympics (BYO) is back for the 2026 Device Packaging Conference. All proceeds from the event...
Will the CHIPS ACT Be “DOGE’d?” And Other Musing from IMAPS Device Packaging 2025
There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites...
Call for Papers: IMAPS DPC 2024
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an...
IMAPS Device Packaging Conference Returns to Arizona in March 2023
The Most Comprehensive Program for Microelectronics and Advanced Packaging This Spring The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16,...
Everything’s Coming up Chiplets at the 2021 Global Business Council
Leave it to Bill Chen, ASE, to set an optimistic tone for the 2021 Global Business Council Spring Meeting. It...
DPC 2021 Online Event Stacked with Community Members Leading Speaker Sessions
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
Looking Back on 2020 and Moving Forward into 2021
COVID-19 hit the world in early 2020 with very little warning. The semiconductor industry was poised for recovery, and all...
Coronavirus Gives Rubbing Elbows a New Meaning at IMAPS DPC 2020
As the domino effect of electronics industry event cancellations continued in response to the global threat of a potential Coronavirus...
Celebrating 25 Years of Advanced Packaging Innovation: Part 1
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS...
Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference
Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual...
Continental Drifts or Tectonic Shifts? Advanced Packaging 2017
That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at...
3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference
Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the...
The Advancement of Device Packaging – A Resume on IMAPS DPC 2017
As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised...
What’s in Store For You at IMAPS DPC 2017
Just under a week away, the agenda for the 2017 IMAPS Device Packaging Conference and co-located Global Business Council is...
Advanced Packaging Alphabet Soup Creates Chaos for IMAPS 3D Panel
All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt,...
Dynaloy™ Researchers to Detail One-Step Cleaning Process for TSVs
INDIANAPOLIS, Ind., February 24, 2014 – A team of researchers from Dynaloy and Solid State Equipment Corporation (SSEC) have developed...
3D Talk at IMAPS DPC 2013
At this year’s IMAPS International Device Packaging Conference, despite a robust line-up of speakers and presentations focused on 2.5D and...Food for thought from the test and burn-in guys
Sometimes I like to mix it up a bit. So last night I was the invited guest speaker at the...