The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Submit your abstract and/or Professional Development Course by October 13.

Technical Program Includes:

Heterogeneous 2D & 3D Integration
Fan-Out, Wafer Level Packaging & Flip Chip
Next Gen Applications (Automotive, 5G/6G…)
Interactive Poster Session

Committing Major Sponsors through September 6.


 Submit Abstract/PDC

due by October 13

 Exhibit/Sponsor Prospectus 



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