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IFTLE 602: Dr. Dev Palmer in at NAPMP; A New Player in Glass Core Substrates
Dr. Dev Palmer Takes over the Reins CHIPS NAPMP The Department of Commerce has announced that Dr. Dev Palmer has...
Onto Innovation Further Strengthens Company’s Panel Portfolio with New Glass Suite
Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition...
The Growing Importance of Glass Substrates in Semiconductor Technology
The semiconductor industry is experiencing a significant shift towards the use of glass substrates, driven by their superior performance characteristics...
EV Group Doubles Throughput of Innovative Semiconductor Layer Transfer Technology
The dedicated HVM EVG®880 LayerRelease™ system boosts productivity and lowers the cost-of-ownership of novel infrared laser release technology through silicon...
Discover Wafer Universe: Your Premier Source for Standardized Wafers
Plan Optik AG is excited to introduce Wafer Universe, crafted to meet the urgent needs for standardized wafers with a...
IFTLE 575: Intel’s Interest in Glass Core Substrates
Intel recently announced that it would use glass core substrates for advanced packaging in the second half of this decade....The Rise of Organic and Glass Substrates
If you are designing a heterogeneously integrated, multi-die, high-performance device for markets such as HPC, AI, data centers, etc., then...
The US CHIPS Act: A Small Business Perspective
As a small U.S. semiconductor packaging company, Mosaic Microsystems is very supportive of the CHIPS Act and looks forward to...
IFTLE 546: AMAT buys into Absolics; Samsung’s AP Team; Update on the CHIPS program under NIST
Last year (IFTLE 512) we discussed the SKC formation of the US subsidiary Absolics, and its glass core substrate manufacturing...
Thin Glass: A Simplified Path to Copper-Filled Through-Glass Vias
Glass is a compelling substrate for interposer and advanced packaging applications. Compared to organic printed circuit boards, glass has excellent...
Glass Carrier for GaAs Wafer Processing
Gallium arsenide (GaAs) is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits,...
IFTLE 509: IEEE 3DIC 2021 – Glass Embedding and 3D Retinal Prosthesis
Finishing up our coverage of the 2021 IEEE 3DIC conference, we take a closer look at glass embedding, 3D stacked...
LPKF Receives a Major Order from a Leading Chip Manufacturer for High Volume Manufacturing Equipment of Glass Wafers for Semiconductor Packaging
Garbsen, 1 June 2021 – LPKF Laser & Electronics has received a follow-up order for additional laser systems from the...
Glass-based Solutions for Packaging are Here
A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring...
RF Technology in a Complete Glass Package
In order to remain competitive in the Internet-of-Things (IoT) environment, medium-sized industrial and process measurement technology companies must increasingly integrate...