Latest Posts - Page 3
A Fan-Out Wafer Level Packaging Epiphany
I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential...
Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package
There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP)...
Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing
Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding... Will Fan-out Packaging be Sustainable Long-term?
2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and...
Discussing Panel Scale Packaging at SEMI’s Northeast Forum
SEMI did a great job at SEMICON West 2016 organizing a bursting-at-the-seams amount of technical content presented on the show...
Fraunhofer IZM Panel Level Packaging Consortium Launches in Berlin
In the bric-à-brac collection that seems to form my particular set of memories and mental associations, I have at least...
Executive Viewpoint: The New Advanced Packaging Landscape
You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had...
“How Do You Create The Future?” Through Innovations in Heterogeneous Integration and SiP
MEPTEC Luncheons returned big to The Bay Area on Wednesday, May 25, 2016, with a new venue (SEMI HQ), a... Cypress Subsidiary Deca Technologies to Receive $60 Million Investment from ASE
SAN JOSE, Calif.,- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX and Deca Technologies, a subsidiary of Cypress Semiconductor Corp....
Convergence on the “Big Five”: Focus on Low-cost Flip Chip
Part one of a five-part series. Over the past few years, there has been a significant shift from PCs and...
Panel-level Packaging: the High Volume Manufacturing Roadmap has Yet to be Built
Over the past few years, it becomes clear that some panel-level packaging choices will be more suitable than others for... Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed...
Success for 3D: What A Difference a Year Makes
During the 2015 European 3D TSV Summit, I drove attendees to distraction by asking each presenter what success looked like...
European 3D Summit: Putting 3D Packaging To Work
Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging...
European 3D Summit: Market Analysts Weigh in on FOWLP, 3D Packaging, and SiP
As it has in year’s past, the 2016 European 3D Summit kicked off with a market briefing. We heard from...
The European 3D Summit: From Roadmaps to Reality
In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected...
SPTS sees a Brighter 2016
In contrast to some of the gloomier predictions of the analysts, we think 2016 will be a growth year for...
Deca Technologies Sees Promise in FOWLP for 2016
According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3...
