Garry Pycroft, Author at 3D InCites

Deca Technologies Sees Promise in FOWLP for 2016

Deca Technologies Sees Promise in FOWLP for 2016

According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3 years. This demand is driven by a combination of several factors. Primarily there is great potential for the advanced capabilities of FOWLP to provide cost-effective system-level solutions for mid- to high-pin-count components by addressing the size and performance requir... »