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With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies are the shining stars of the next generation of electronics, the 66th Annual IEEE Electronic Components Technology Conference, which takes place May 31-June 3, 2016, at the Cosmopolitan of Las...
TEMPE, Ariz. – March 23, 2016 – Amkor Technology Inc. (Nasdaq: AMKR), a leading semiconductor packaging and test service provider, today announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications. This achievement establishes Amkor’s leadership in delivering low-cost, high-performance advanced SiP solutions....
Since the dawn of the industry, semiconductor companies have developed disruptive technologies and solutions that have met the most ambitious targets. In a dynamic and global marketplace, they anticipate market needs and design and make the right product at the right time. What’s the key to this success? The supply...
On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress and the power of TSMC’s Grand Alliance. As a former Alliance Manager, I really enjoyed seeing how TSMC’s far-reaching vision and strategic alliances, combined with excellent execution and customer service,...
Garching, September 24, 2015 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, has received an order for multiple SUSS MicroTec Photonic Systems lithography tools in Q3 2015 from a leading semiconductor manufacturer. The strategically important order includes multiple DSC300 Gen2...
I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it’s a great parody of what life in the Valley taken over by socially awkward technology geniuses looks like. It’s pretty funny, and a little bit scary. In one episode, the Pied Piper team is presenting...
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I found very useful to contribute to the advancement of single- and multi-die packaging. To make it easier for the reader to dig deeper and review the entire paper, I included in...
With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the alphabet soup of package options for split die. Application targets range from high-performance solutions for devices such as FPGAs to application processors found in mobile devices. SLIM, SWIFT, EMIB, NTI,...
Yole Développement invites you to discover the main technology trends and business opportunities for 3D integration in 2015. As a research market & strategy consulting company, Yole Développement (Yole) works with the leaders of the advanced packaging industry every day to understand technical challenges and market issues. In this article,...
One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and it becomes clear that this year the conference organizers have left no stone unturned. Kicking it off with Pre-conference Symposia that emphasize 3D design tools and flow and manufacturing processes,...
