Blogs Archives - Page 26 of 85

3D In Context View all

SEMICON West Navigates Semiconductor Industry Changes

Nov 18, 2025 · By Dean Freeman · 3D In Context

As Benjimen Franklin said, shortly after the US Constitution was written, “In this world, nothing can be said to be certain, except death and taxes.” I’ll add one comment to that: Change. Change is constant. Over the past year, there has been a significant amount of change in the semiconductor...

Advanced Packaging: A Community Coming Together

Nov 12, 2025 · By Dean Freeman · 3D In Context

In the past 16 years, 3D InCites has watched the 3D packaging industry grow. The philosophy of 3D InCites was to create an advanced packaging community. At SEMICON West in Phoenix, the community was out in force, from ribbon-cutting ceremonies for new facilities, to new packaging equipment companies showing for...

The 3DICAMA and Other Efforts to Develop the 3D IC Ecosystem

Oct 14, 2025 · By Dean Freeman · 3D In Context

This Fall has been a busy time for semiconductor events. Starting with SEMICON Taiwan at the start of the month, IMAPS in Late September into early October, followed closely by SEMICON West last week. Fortunately, there is a month off to catch your breath before heading to Semicon Europa. There...

Can We Make Data Centers Less Power Hungry?

Aug 19, 2025 · By Dean Freeman · 3D In Context

When the headline reads “Power Usage in Wyoming data center could eclipse consumption if the state’s human residents by 5x, the tenant of colossal investment remains a mystery.“ It grabs your attention. The article goes on to discuss that the data center is expected to start at 1.8 gigawatts and...

Francoise in 3D View all

Passing the Torch: Reflections from SEMICON Europa 2025

Nov 24, 2025 · By Francoise von Trapp · Blogs

While announcing my retirement after 20 years in the industry at IMAPS Symposium brought my career in advanced packaging full circle, wrapping up my 3D InCites career at SEMICON Europa brought closure. It was at SEMICON Europa 2007, held in Stuttgart, where my fascination with 3D integration and packaging first...

Francoise Unfiltered: Thoughts from IMAPS Symposium and SEMICON West

Oct 15, 2025 · By Francoise von Trapp · Blogs

Maybe it’s my impending retirement, but I’m feeling a little salty these days. This my fifth draft about the highlights, low-lights and Aha moments of both IMAPS Symposium and SEMICON West. And I can’t get it right. All that comes up is my annoyance with carefully crafted messaging because nobody...

Changes at 3D InCites: Here’s What You Need to Know

Oct 01, 2025 · By Francoise von Trapp · Blogs

I recently realized that IMAPS Symposium 2025 marks my 20th anniversary in the microelectronics industry. It was the first industry event I attended, as the Associate Editor of Advanced Packaging Magazine. My first SEMICON West was in 2006, and my first SEMICON Europa was in 2007. That was when I was first...

IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley

Sep 29, 2025 · By Francoise von Trapp · Blogs

To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help of the local committee and the IMAPS team – the first ever IMAPS Executive Summit. The theme was Advanced Packaging 2025: Market Momentum & Investment Outlook. According to Beica, what...

From Different Dimensions View all

Reflections on My Year as the 3D InCites Editorial Intern

Dec 10, 2025 · By Camden McCrea · Blogs

Over the past year, my role as the 3D InCites editorial intern has given me a front-row seat to one of the most dynamic corners of the semiconductor world: advanced packaging and heterogeneous integration. My duties spanned writing Member Monthly News, creating LinkedIn content, contributing feature articles, and even representing...

November Member News: Shaping the Future of Semiconductors

Dec 02, 2025 · By Camden McCrea · Blogs

November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating leadership achievements, expanding global operations, and advancing workforce development. From product launches and AI‑enhanced design platforms to award recognitions and strategic partnerships, industry leaders highlighted breakthroughs in advanced packaging, inspection,...

From Reactive to Proactive: Semiconductor Shipment Visibility in 2025 and Beyond

Nov 17, 2025 · By Shreya Mehta · Blogs

In 2024, electronics cargo theft, including semiconductors, servers, and high-end computing equipment, surged dramatically, exposing a critical vulnerability in supply chains. ¹ This threat is not just a security issue for companies shipping semiconductors and other high-tech components; it directly impacts revenue, causes production delays, and compromises customer trust. Often,...

Jessica Yang: My Summer Internship at Saras Micro Devices

Nov 11, 2025 · By Saras Micro Devices · Blogs

By Jessica Yang, HR Intern, Saras Micro Devices Hi, I’m Jessica Yang, a rising junior at Washington University in St. Louis, studying Organizational & Strategic Management and Sociology. With my two interests, I’ve always been passionate about the people side of business, which is why I was looking for internships...

Interconnectology 101 View all

The EU’s Semiconductor Strategy: CHIPS Act 2.0, Investments, and More

Dec 03, 2025 · By Jillian McNichol · Interconnectology 101

I recently attended SEMICON Europa in Germany to learn how the EU is approaching the next phase of its semiconductor development. From what I learned, the EU is moving its industry forward by planning for its CHIPS Act 2.0 legislation, attracting new investments, and funding competitive R&D pilot programs. In...

Co-Packaged Optics: Today’s Biggest Packaging Push

Nov 26, 2025 · By Jillian McNichol · Interconnectology 101

Co-packaged optics is one of the most talked about innovations in advanced packaging right now, and it’s for good reason. It promises higher bandwidth density, lower power consumption, and reduced latency over other packaging approaches – all of which are essential for enabling smarter AI solutions. To learn more about...

Will AI Ever Become Profitable?

Nov 04, 2025 · By Jillian McNichol · Interconnectology 101

Last year, I wrote a blog on the growth of AI, where I broke down the public hype around the technology and the barriers preventing it from scaling further. Earlier this year, Gartner projected that worldwide AI spending will reach $1.5 trillion by the end of 2025, up $490 billion...

Geopolitical Changes, Sustainability Progress, and Collaboration Efforts at SEMICON West 2025

Oct 20, 2025 · By Jillian McNichol · Interconnectology 101

This year’s SEMICON West was its largest exhibition in over 18 years. With a 60% boost in registrations over 2024, the size of SEMI’s first-ever Phoenix conference points to growing interest in the semiconductor industry. As you can imagine, much of this interest is driven by AI. On October 7th,...

Packaging IFTLE View all

IFTLE 649: Let the Hybrid Bonding Wars Begin! Also: Samsung Locks in Glass Interposer Source

Dec 08, 2025 · By Phil Garrou · Blogs

Adeia vs AMD Hybrid bonding is a semiconductor packaging technique that enables direct Cu-Cu and oxide-to-oxide connections, eliminating the connection using microbumps. This approach improves interconnect density, electrical performance, and thermal efficiency, making it an important advanced packaging technology for next-generation semiconductor devices. Adeia Semiconductor Solutions, a wholly owned subsidiary...

IFTLE 648: Unimicron Glass Core Substrates and Hybrid Bonding

Dec 01, 2025 · By Phil Garrou · Blogs

With all the hype surrounding the potential use of glass interposer substrates and hybrid bonding, I thought taking a deep dive look at the recent publication “Flip Chip on Glass Core Substrates with Microbump and Cu-Cu Hybrid Bonding” ,which appeared in the IMAPS Journal of Microelectronics and Electronic Packaging, by...

IFTLE 647: Micross AIT on Track to Deliver 300mm Bumping Onshore

Nov 25, 2025 · By Phil Garrou · Blogs

Continuing our look at program information deemed “OK for public release” at the recent IMAPS Onshoring conference, let’s examine what Micross had to say about progress on its Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) 300mm bumping line, sponsored by DARPA’s Industrial Base Analysis and Sustainment (IBAS) program....

IFTLE 646: TSMC 3Dblox 2.0 Helps Advanced Packaging Designs

Nov 19, 2025 · By Phil Garrou · Blogs

The 3Dblox Open Standard Continues to Evolve Introduced in 2022, the 3Dblox open standard has provided EDA vendors with a pathway to model the essential physical stacking and logical connectivity information for 3D IC designs in a single format. 3Dblox reportedly simplifies 3D IC design by providing a complete view...

Blogs

Sustainability 101: Farewell From Julia

My Message for the Advanced Packaging Industry

IFTLE 650: Tax Credits for Materials Suppliers; Amkor Automotive

3D In Context View all

Francoise in 3D View all

From Different Dimensions View all

Interconnectology 101 View all

Packaging IFTLE View all

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