At the recent IMAPS virtual/live hybrid meeting from San Diego, I was most interested in the workshop run by Fraunhofer IZM on what 6G telecom means for Advanced Packaging. Let’s take a closer look at the presentation by Ivan Ndip .
5G appears in multiple forms (Figure 1)
Breakthrough 5G will be 5G mm-wave technology. That will require major modifications to current packaging technologies, including new designs and new materials. Several 5G packaging options have been described from IBM, Infineon, ASE, TSMC, GaTech, and Fraunhofer as shown in Figure 2.
It is believed that 5G mm-wave will have many expanded use cases as shown in Figure 3.
Why do we need 6G ?
- Autonomous driving
- Robotic surgery/telemedicine
- Network controlled robots for industrial automation
TB/sec is needed for autonomous driving and medical apps. For autonomous driving, sharing info between cars i.e high data rate and low latency is critical. In telemedicine, robot instructions must be instantaneous and images must be high definition. One must eliminate delay in the compression/decompression process
Packaging Requirements for 6G
- Integration of antennas at ICs in different layers + antenna shielding
- integration of caps close to ICs for stable PDS
- the direct thermal path from ICs to the outside world
- Variable thicknesses for impedance controlled TMLs, vias, passives, and antennas(> 100GHz)
- low Df, Dk, and metallization losses > 100GHz
- Low warpage…generally processable
- short interconnects (e.g. amp to antenna)
- interconnect paths with few discontinuities
Proposed Fraunhofer solutions include:
Both have short connections from ICs to antennas. Such structures are being developed under the 6Gkom project using the capabilities of several of the institutes as shown below.
This is supported by the industrial advisory board shown below.
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