5G

How 5G is Enabling a Connected World

How 5G is Enabling a Connected World

It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in front of you; allow you to download all six seasons of Downton Abbey while you are waiti... »

IMAPS 2019: Stalled Scaling Begets AI Opportunities For Heterogeneous Integration

IMAPS 2019: Stalled Scaling Begets AI Opportunities For Heterogeneous Integration

Chiplets and 5G were a kind of buy-in to play at the IMAPS 2019 Symposium high-stakes table last week in Boston, MA, but it was heterogeneous integration that took many a pot during the three days of the symposium, particularly when IBM Research held the HI cards. The quick summary from IMAPS about attendance at the Symposium is that “Final registration figures proved that IMAPS 2019 was the in... »

5G: The Battle Still Rages

5G: The Battle Still Rages

Consumer demand for mobile phones weakened in 2018, resulting in a market decline. In this context, the competition has intensified, creating an emulation to push 5G forward. Yole Développement (Yole) announces an 8% CAGR[1] between 2018 and 2025 for the RF[2] front-end market. Reaching US$15 billion in 2018, this industry should reach US$25.8 billion by 2025, confirms the RF electronics team at ... »

Talking about Technology Megatrends at SEMICON West 2019

Talking about Technology Megatrends at SEMICON West 2019

What a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON West, the Moscone Center renovation is complete and looks fabulous. It’s also so much easier to navigate between halls, and to and from the keynote stage at the newly christened Blue Shield of California Theater. Last year at SEMICON West, the semiconductor industry was flyin... »

SiP Technology To Enable Technology Megatrends

SiP Technology To Enable Technology Megatrends

Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS executive committee decided to combine the two co... »

Heterogeneous Integration Component Flavors SEMI ASMC 2019

Heterogeneous Integration Component Flavors SEMI ASMC 2019

“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large functions, combined with functional design and construction, should allow the manufacturer of large systems to design and construct a considerable variety of equipment both rapidly and economically.” G. Moore, “Cramming more comp... »

The 5G Revolution is Pushing Innovations for RF front-end SiP

The 5G Revolution is Pushing Innovations for RF front-end SiP

Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular and connectivity. It is clear for everyone that 5G will totally redefine how the radio frequency (RF) front-end interacts in-between the network and the modem. The new RF bands (sub-6 GHz and mm-wave, as defined in 3GPP release 15) pose big challenges for the industry. The ... »

Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018

Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018

There’s fact, and there’s perception. The messages people carry away from conferences are not only influenced by what they hear from the speakers, but also from the conversations they have with their colleagues. This post contains a little of both. At IMAPS Device Packaging Conference in March, Yole Developpement analyst, Emilie Joliet announced to the industry that at long last, 3D in... »

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018

The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the Gartner Hype Cycle listings from 2008 as I just did you would find, perhaps to your surprise, that Cloud Computing, 3-D Printing, Solid-State Drives, and Augmented Reality are now things, having made it past 2008’s inflated expectations, and the disillusi... »

Citius, Altius, Fortius Redux: More From SEMICON Korea 2018

Citius, Altius, Fortius Redux: More From SEMICON Korea 2018

The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their sights on SEMICON China this month after all that snow-in-Seoul settled, but I still have a few more comments about the Electropackage System and Interconnect Product technical session SEMI organized for the afternoon of 01 February 2018, and on which I reported in my first installme... »

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