Last week (November 6) STATS ChipPAC issued a press release announcing that its advanced eWLB provides a platform for 2.5D...
At last week’s 3D Test Workshop in Anaheim, CA, I had the pleasure of moderating a panel of industry experts,...
The latest digital issues of Chip Scale Review and iMicronews’ 3D Packaging magazines hit the virtual “stands” last week, and...
After listening to John Ellis, semiconductor industry veteran and author of the techno-thriller, The Dormant Curse, expound on the threat...
All Programmable PlanetToday All Programmable Planet’s newsletter appeared in my inbox, with a great post by Max Maxfield on the...
Today's 3D day kicked off with a very broad and thorough state-of-the-technology report from imec's perspective, presented by Paul Marchal. ...
Tomorrow's the big 3D day, but today's keynote from Nicolas Sillon of CEA Leti on "Silicon Interposer: Much More than...
While everyone’s waiting for the big memory houses like Micron and Samsung, and IDMS and foundries like IBM and TSMC...
Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., introduced its DIMM-IN-A-PACKAGETM multi-die face-down...
Georgia Tech Packaging Research Center (GT-PRC), through an industry consortium of about ~15 semiconductor, package and supply-chain companies from US,...
Glass interposers got a thumbs up from i-MicroNews in a “Closer Look” post reviewing Corning’s Peter Bocko’s presentation at IMAPS 2012. ...
Have you noticed that it’s not even Halloween and the stores are already setting up their Christmas sections? Seems to...
Is today the anniversary of something and I missed the memo? Because in less than 5 minutes of surfing, I’ve...
But first, a 3D history lesson thanks to a recent SemiWiki blog post, Hybrids on BeO then, 3D-IC in silicon now,...
TSMC certainly did hand out keys to the city to the EDA vendors last week at OIP. Just to recap,...
If you have an hour of professional development time coming to you, I advise that you spend it watching this...
Fridays just kind of creep up on you, don’t they? It’s been a busy week in the 3D blogosphere –...
Eric Beyne (imec) and I go way back. He’s the Scientific Director of Advanced Packaging Technologies at imec, and ever...
Because 3D Memory really stands out as an industry apart from 3D ICs, I’ve been collecting some interesting articles over...
Over the summer, we became a 3 iPad household; my daughters because they were headed off to college and iPads...
