They call me the “Queen of 3D” because I have been following the course of 3D integration and blogging about it since 2009. Francoisein3D is the featured blog on this site.
Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., introduced its DIMM-IN-A-PACKAGETM multi-die face-down...
Georgia Tech Packaging Research Center (GT-PRC), through an industry consortium of about ~15 semiconductor, package and supply-chain companies from US,...
