Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., introduced its DIMM-IN-A-PACKAGETM multi-die face-down (xFD)TM technology for thin and light notebooks, also known as UltrabooksTM, and tablet computers.
Invensas’ novel solution delivers the memory capacity and performance of a small outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package. Although the number of dynamic random access memory (DRAM) chips may vary depending upon the architects’ need, a DIMM-IN-A-PACKAGE incorporating one typical product, the Quad Face Down (QFDTM) package, can replace a single-sided SO-DIMM in a 16 x 16 x 1.0mm form factor, making it ideal for today’s ultra-thin electronics.
“Right now, portable electronics roadmaps demand not just evolutionary products to reduce size and increase performance, but revolutionary solutions that provide a radical simplification of the product design and the supply chain,” said Simon McElrea, president of Invensas. “The memory challenge goes well beyond providing the required capacity. It’s about creating solutions that significantly reduce motherboard size and complexity, while increasing battery size (and hence life), and then dealing with all the heat. DIMM-IN-A-PACKAGE addresses all these issues simultaneously.”
Invensas will offer demonstrations of its xFD solutions in booth GE23 at the Intel Developer Forum (IDF) taking place April 11 and 12, 2012 at the China National Convention Center in Beijing. Invensas will present its Ultrabook DIMM-IN-A-PACKAGE solution at the International Conference on Electronics Packaging (ICEP) at Tokyo Big Sight in Tokyo, Japan. Titled “A multi-die DRAM package for solder-down memory in Ultrabook and Tablet PC applications” and coauthored by Dell Inc., the paper will be part of the technical session program taking place in Room B at 10:50 AM on Friday, April 20, 2012.