Francoise News - Page 24
Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside
Somehow in all my preparations for the 2014 3D InCites Awards and planning the schedule for SEMICON West this week,...
2014 3D InCites Guide to 3D at SEMICON West
I can’t believe it’s already been a year since I last posted my annual guide to 3D at SEMICON West. ...
Time to Cast Your Votes for the 2014 3D InCites Awards!
The nominations are officially closed for the 2014 3D InCites Awards; and now comes the fun part. This year, while the industry...
KLA Tencor: CV310i Wafer Edge Inspection and Metrology Module
CIRCL CV310i module is an advanced Wafer Edge inspection, metrology and profiling system tailored for Advanced Wafer Level Packaging. Simultaneous... SSEC: Wet Etch Process for TSV Reveal
SSEC’s wet TSV reveal process achieves -/+ 0.7% Si thickness uniformity under the appropriate post grinding conditions with fast throughput.... Akrion Systems: Vacuum Prime and Dry
Akrion Systems’ vacuum prime and drying technology enables the use of a wet immersion method to introduce liquid chemicals or... SORIN CRM: 3D IC Module for Active Medical Implant
Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has... SETNA: Process for Room Temperature 3D IC Assembly
SETNA, in conjunction with Research Triangle Institute (RTI), has developed a binary alloy (Silver-to-Indium) bonding system for 3D IC assembly... Schiltron 3D Flash
Schiltron 3D Flash replaces 2D-NAND. It uses a unique architecture solving key challenges associated with other 3D-NAND approaches: scalable; no...
3D InCites Interview: RTI in 3D
While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for...
Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?
On one side of the fence, we have semiconductor device manufacturers (fabs, foundries, and OSATS) claiming to be ready to... Novati Technologies: Silicon Interposer Module
The 2.5D Interposer Module features three front-side interconnect layers of dual-damascene copper on top of a single-damascene copper metal layer,...
Fine Tuning Processes for TSV Reveal
Through silicon via (TSV) reveal is a critical part of the wafer-thinning step in 3D IC backside processing, where the...
Setting the Record Straight On Applied Materials’ PVD Tool for 3D TSVs
Nothing makes me click a link faster than a title like “3D Chip Stack Tool Sends TSV Into High-Volume”, because...
Glass Interposers Take the Stage at ECTC 2014
I have to admit, for some time I’ve been fairly skeptical about glass interposer technology as a viable alternative to...
ECTC 2014: Bridging the Gap to 2.5D and 3D
Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers... SSEC: WaferEtch TSV Revealer
SSEC’s WaferEtch™ TSV Revealer is a single wafer wet processing platform for 3D IC and interposer wet etching applications designed... Lasertec: BGM300
The BGM300 was designed to enable quick and accurate measurement of Through Si Via (TSV) depths, Si wafer thickness, and...
