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Adeia Signs Long-Term Semiconductor Patent License Agreement with Kioxia
Agreement includes a license to Adeia’s Hybrid Bonding Portfolio SAN JOSE, Calif., March 28, 2023 — Adeia Inc. (Nasdaq: ADEA)... Adeia Signs Long-Term Semiconductor Patent License Agreement with Western Digital
Agreement includes a license to Adeia’s Hybrid Bonding Portfolio SAN JOSE, Calif., March 28, 2023 — Adeia Inc. (Nasdaq: ADEA)...
Community Member Preview: Chiplet Summit
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968,...
ESTC 2022 Member Company Preview
Chaired by 3D InCites Community member Steffen Kröhnert of ESPAT Consulting, the Electronics System-Integration Technology Conferences (ESTC) series is a...
IFTLE 528: 72nd IEEE ECTC: A Showcase for Hybrid Bonding
The 72nd IEEE Electronic Components and Technology Conference (ECTC) took place at the end of May in San Diego CA....
ECTC 2022 Member Preview — Stacked and Packed
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components...
SkyWater Enters License Agreement with Xperi for Hybrid Bonding Technology
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging KISSIMMEE, Fla....
Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License Agreement
Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how SAN JOSE, Calif. & YOKOHAMA, Japan, May 04, 2022–(BUSINESS WIRE)–Adeia, the newly...
IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
Xperi and Micron Enter Into License Agreement for Hybrid Bonding
Xperi’s IP Licensing Business Deepens its Presence in Memory Market SAN JOSE, Calif.–(BUSINESS WIRE)–Adeia, the newly launched brand for the...
IFTLE 504: YMTC Implements Hybrid Bonding for 128-Layer 3D NAND
Xperi Licenses Hybrid Bonding Technology to YMTC (Yangtze Memory Technologies Co) In October, Xperi announced it had licensed its hybrid...
Xperi Licenses Hybrid Bonding Technology to Yangtze Memory Technologies Co., Ltd. (YMTC)
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to YMTC for its 3D NAND memory products SAN JOSE, Calif. –Xperi...
ECTC 2021 Features the Hottest Topics and Trends in Microelectronics
For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1,...
IFTLE 485: TSMC, Samsung and Sony Showcase Advanced Packaging at 2021 IEEE ISSCC
Finishing up our look at the 2021 IEEE ISSCC, Forum 5 was entitled Enabling New System Architectures with 2.5D, 3D,...
DPC 2021 Online Event Stacked with Community Members Leading Speaker Sessions
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
The People Who Make DBI Possible
A Conversation with the Xperi Hybrid Bonding Team In the world of heterogeneous integration, hybrid bonding — and in particular,...
What I’m Thankful for This Thanksgiving
2020 has been a year for the books. Honestly, between the divisiveness in the USA caused by this year’s election...Xperi Licenses DBI to Canon for CMOS Image Sensors
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products SAN JOSE,...
