Latest Posts - Page 2
3D System Integration – It Takes a Village
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this...
Xperi and Tower Semiconductor Announce New License for 3D Stacked Image Sensor Technology
Invensas direct and hybrid bonding technologies licensed by Tower Semiconductor to further enhance its outstanding pixel performance and significant competitive...
Social Distancing Spotlight: A DBI Ultra Update
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer...
IFTLE 445: Hybrid Bonding at Xperi, GLOBALFOUNDRIES and Besi
The expansion of hybrid bonding as a process for high-density packaging was the topic of some presentations presented at the...
Novel Multi-die Integration Concept Offers Big Benefits
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of...
Hybrid Bonding: From Concept to Commercialization
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications,...
Announcing the Winners of the 2018 3D InCites Awards
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and...
Xperi Sets Out to Enable Immersive Experiences
Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was...
SMIC Signs License Agreement For Invensas’ DBI Technology
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
The Advancement of Device Packaging – A Resume on IMAPS DPC 2017
As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised...
