InFO

Reaping the Benefits of a Design and Manufacturing Ecosystem

Reaping the Benefits of a Design and Manufacturing Ecosystem

As it does each year, TSMC recently brought 45 of its ecosystem partners together for its annual Open Innovation Platform® Forum to demonstrate to joint customers the value of a well-managed IC design and manufacturing ecosystem. TSMC and many of the partners presented recent accomplishments and explained in 33 technical papers how they support customers in today’s challenging markets for elect... »

IFTLE 417: Passing the Advanced Packaging Baton to TSMC’s 3D-MiM                                                

IFTLE 417: Passing the Advanced Packaging Baton to TSMC’s 3D-MiM                                                

As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of advanced microelectronics, packaging breakthroughs were developed by integrated device manufacturers like IBM, DEC, NEC, Fujitsu, etc. In the early 2000s, this baton was passed to the OSATS like Amkor, ASE, SPIL, and STATSChipPAC. As it became more obvious that advanced packaging was going wafer... »

The 14th 3D ASIP Conference Addresses a Spectrum  of 0pportunities, Part 1

The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1

Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Conference). Rechristened to 3D Architectures for Heterogeneous Integration and Packaging (still 3D ASIP), each December sees several hundred key players from across the supply chain meeting to discuss mar... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »

Fan-out Packaging Confirms its Success Story

Fan-out Packaging Confirms its Success Story

Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next killer application? Many important questions face the fan-out packaging indu... »

Pasadena offers Roses and Technology

Pasadena offers Roses and Technology

California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It takes commitment and organizational talent to make these events successful for 100+ years, and encourage every contributor to prepare and execute successful events every year. Last week’s International Microelectronics Assembly and Packaging Solutions Conference (iMAPS) in Pasadena’s Con... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP Symposium 2016

After a fairly long vacation it’s very hard to get back to work. That’s why I was really glad that this year’s OIP Symposium helped me – right after touring Europe for 3 weeks – to finding my groove again. Allow me to share some of my observations at and thoughts about the Symposium, from my “More-than-Moore EcoSystem builder” perspective. The collaborative innovation programs TSMC ... »

System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology

System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology

System Plus Consulting announces the release in the next few weeks of a complete report on TSMC’s Integrated Fan-Out (inFO) technology used for Apple’s A10® processor packaging. And few results are already available. Indeed System Plus Consulting’s experts propose you to discover a previous of the first conclusions. Featured in the latest Apple iPhone 7®, the Apple A10 processor has high... »

22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead

22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead

Earlier this week I had the opportunity to attend this year’s TSMC Symposium. Just like in many previous years, TSMC had a lot of progress to report and demonstrated that they have a clear vision of the road ahead. As I expressed in previous years’ blogs, I started to get to know TSMC as a formidable competitor when I was marketing ASIC solutions at VLSI Technology. TSMC led the transition fro... »

At 3D ASIP 2015, Variety is the Spice of Life

At 3D ASIP 2015, Variety is the Spice of Life

Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s been laser-focused on one emerging segment since its inception. But this past week, 3D Architectures for Semiconductor Integration and Packaging  (3D ASIP 2015) delivered a program that not only addressed the progress of 3D integration, it also expanded... »

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