Latest Posts
IFTLE 417: Passing the Advanced Packaging Baton to TSMC and its 3D-MiM
As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of...
The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D...
TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem
Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara...
Fan-out Packaging Confirms its Success Story
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain...
Pasadena offers Roses and Technology
California’s Pasadena is well known for the New Year Rose Parade and the Rose Bowl. There is no doubt: It... TSMC’s OIP Symposium 2016
After a fairly long vacation it’s very hard to get back to work. That’s why I was really glad that...
System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology
System Plus Consulting announces the release in the next few weeks of a complete report on TSMC’s Integrated Fan-Out (inFO) technology...
22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead
Earlier this week I had the opportunity to attend this year’s TSMC Symposium. Just like in many previous years, TSMC...
At 3D ASIP 2015, Variety is the Spice of Life
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s...
Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
3D Stacking is Part of Life
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil...
Chasing the Fan-out Wafer Level Packaging Rabbit at IWLPC 2015
Sadly, this year it was the 3D session track that had lots of empty seats at the 2015 International Wafer...
TSMC’s Grand Alliance: A Powerful EcoSystem
On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress...
Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the... TSMC 2015 Technology Symposium Highlights Plans for the Coming Year
Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual...
IMAPS DPC 2015: Has 3D IC Hit a Holding Pattern?
From the perspective of 3D integration and its march towards commercialization, there was not much new being presented at the 2015...