Latest Posts
YES Panel-Level Through Glass Via (TGV) Etch Tool Placed in Production
YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and AR/VR applications, today announced that its...
IFTLE 512: SKC Announces Glass Substrates for BGAs; TSMC Expands Packaging
Over the past several years many companies have been extolling the virtues of glass as a packaging medium. Corning Glass,... Glass-based Solutions for Packaging are Here
A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring...
Cu-Interposer Drives Connectivity to the Next Level
Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new...
Products on Parade in the Exhibits at IWLPC 2019
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out...
Tech Round-up from ECTC 2018
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather...
Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
Georgia Tech Forms a Panel-based Global Glass Industry Consortium
At the IEEE Global Interposer Technology (GIT2014) Workshop held at Georgia Tech on November 5-7, 2014, Georgia Tech announced the formation...
Putting Their Money on Glass Interposers
While the jury is still out on whether glass interposers will play a large or niche role in the interposer...
3D Technology Snapshots from IMAPS 2014
This year’s IMAPS International Symposium purported to have “the most interposer and 3D content under one roof.” I’m not sure...
Lithography Challenges for 2.5D Interposer Manufacturing
In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this... Glass Substrates for Advanced Packaging
Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resistivity and low electrical loss,...
3D InCites Interview: RTI in 3D
While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for...
Glass Interposers Take the Stage at ECTC 2014
I have to admit, for some time I’ve been fairly skeptical about glass interposer technology as a viable alternative to...
ECTC 2014: Bridging the Gap to 2.5D and 3D
Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers...
Notes from GIT 2013
The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
Motivation for 3D IC and other Key Take-Aways from the IEEE 3D IC Conference
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all...
2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on...
