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Xperi Enters into New Patent and Technology License Agreement with SK hynix
SAN JOSE, CA (FEBRUARY 6, 2020) – Xperi Corporation (NASDAQ: XPER) (“Xperi”) today announced that it entered into a new...
IFTLE 418: Xperi DBI Ultra for D2W Hybrid Bonding
Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder...
DBI® Ultra Changes the Game for Heterogeneous Integration
I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve...
Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium
The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA...
Hybrid Bonding: From Concept to Commercialization
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications,...
Xperi Sets Out to Enable Immersive Experiences
Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was...
SMIC Signs License Agreement For Invensas’ DBI Technology
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding
The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This...Fraunhofer EMFT Signs Agreement to Implement ZiBond and DBI Technologies in MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a...
Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a...
3D Stacking is Part of Life
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil...
With the Acquisition of Ziptronix, Tessera Takes the 3D IC Plunge
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas,...
Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived!
Chalk up another industry first for Tezzaron Semiconductor, who announced just today (or tomorrow, if you are there for the excitement at IEEE... Tessera to Acquire Ziptronix, Inc. for $39 Million
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash.... Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding
Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014... Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate 3D IC Development
Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, announced an agreement with Tezzaron Semiconductor Corporation and...
