Latest Posts
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
IFTLE 572: North American Advanced Packaging, New Materials, and New Leaders
This week, we finish our look at papers presented during the IMAPS CHIPCon Conference held in July, 2023, where we...
Community Member Monthly News – September
Let’s catch up on what we missed among our community… Cadence completed the acquisition of the SerDes and memory...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Community Member Monthly News – August 2023
News you may not have seen this month from our community members. Along with some upcoming participation to keep an...
SEMICON Taiwan – Community Member Preview
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its...
CHIPCon 2023: Demystifying the Chiplet Ecosystem
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose....
CHIPcon Community Member Preview
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
Community Member Monthly Highlights — May
SEMI and TechSearch International announced that the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027,...
2023 ECTC Community Member Preview
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
Community Member Monthly Highlights – April 2023
Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
Community Member Monthly Highlights – December
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
Community Member Monthly Highlights – September
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
IFTLE 532: Fraunhofer IZM Examines Panel Level Processing Technology Limits
Continuing our look at presentations at the 2022 ECTC, who better to examine the question “Panel Level Packaging – Where...
What’s Happening at the IMAPS SiP Conference?
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP...
IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
