Ajinomoto

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Electronics Packaging – From Afterthought to Product Differentiator

Nov 17, 2021 · By Steffen Kröhnert · 3D In-Depth

Electronics Packaging vs. Advanced Packaging Electronics packaging is generally divided into three major areas, traditional packaging – also called standard...

Panel Level Packaging Consortium 2.0 Gains Ground

Oct 12, 2021 · By Francoise von Trapp · Blogs

Sometimes, in the face of adversity, great things can be accomplished. In this case, the adversity was the COVID-19 crisis,...

IFTLE 497: Ajinomoto Expands Materials Offerings; BESI readies for Chiplet Era

Sep 22, 2021 · By Phil Garrou · Blogs

Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel...

ECTC 2021 Features the Hottest Topics and Trends in Microelectronics

May 19, 2021 · By Trine Pierik · 3D Event Coverage

For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1,...

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