Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric...
Product Description The Virtex-7 H580T FPGA is the first 3D heterogeneous all programmable device, featuring up to eight 28 Gbps...
“The time has come when we have to understand that we can only compete WHEN we collaborate.” (Sudipto Roy, SMIC,...
“Challenges that need addressing in 2.5D / 3D IC are supply-chain related. The current cost structure for 2.5D / 3D...
The 2013 3D-TEST Workshop focuses exclusively on test of and design-for-test for three-dimensional stacked ICs (3D-SICs), including Systems-in-Package (SiP), Package-on-Package...
A few weeks ago I spoke with SPTS’s David Butler, after he participated in the SEMICON Singapore 3D IC panel....
This year’s 3D InCites coverage of ECTC 2013 features a series of interviews with suppliers to the 2.5D and 3D...
Singapore 29 May, 2013– Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated,...
What is today’s biggest threat to continued growth in the semiconductor industry? Subramani Kengeri, Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES,...
Almost a year ago, Dave Kirsch took over the reins from Steve Dwyer as VP and General Manager of EV...
An industry colleague commented to me recently that the press seems to have lost interest in 3DIC. As probably the...
There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than...
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets has received a...
For the past year or so at various conferences, symposiums and summits focused on 2.5D and 3DIC technologies; we’ve been...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...
When it comes to fully understanding 3D integration processes, Sarah-Lyle Dampoux (my tour...
If you had been a fly on the wall in my office last week, you would have seen more than...
One of the questions plaguing all of us waiting for the adoption of TSVs for 3D IC stacking is what's...
As my first official week blogging about 3D IC packaging technologies winds down, I'm thinking a Friday wrap-up is in...
