SUSS MicroTec Announces Follow-up Order for 300mm Bonding Tools for HVM 3D ICs

SUSS MicroTec Announces Follow-up Order for 300mm Bonding Tools for HVM 3D ICs

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets has received a follow up purchase order for the latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM (Integrated Device Manufacturer). The customer, who  installed SUSS MicroTec tools in 2012, plans to enter into a pilot production with the new systems. The bonder systems are configured to temporarily bond and debond 300mm wafers for 3D integration processes in logic and memory applications using the TMAT (Thin Materials) process and adhesive materials. Delivery of the bond cluster is expected for the second half of the fiscal year 2013.