wafer bonding

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced wafer bonding solutions will be highlighted in several papers being presented at the 2019 IEEE 69th Electronic Components and Technology Conference (... »

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology for nex... »

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG® ... »

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company’s industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion and hybrid wafer bonding, the... »

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG’s “Manufacturing III” facility, which will more than double the floor space for the final assemb... »

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since expanded its presence to include offices in Fukuoka and a state-of-the-art applic... »

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and te... »

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafe... »

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems

Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection, post wafer thinning and metallization. The 4... »

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices. These capabilities include a new vacuum bond alignment module that provides... »

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