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Tokyo Electron Introduces Ulucus™ L, a Laser Edge Trimming System for 300ｍｍ Wafer-Bonded Devices
Tokyo Electron (TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) today announced the launch of Ulucus™ L, a laser edge...
EV Group Establishes State-of-the-Art Customer Training Facility at Corporate Headquarters
EVG Academy doubles the amount of training space and technical trainers; provides training on every class of EVG equipment and...Mosaic Microsystems Secures $2 Million Seed Round from BlueSky Capital and Corning
Rochester, NY — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for...
EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey
EVG continues win streak with 17th consecutive year listed among “THE BEST” suppliers in survey results; frequently cited by customers...
10 Years of Invent, Innovate, Implement at EV Group
Of all the companies that have supported 3DInCites over the past 10 years, none has been more consistently involved, both...
EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019
Technical papers and interactive poster to highlight the breakthrough capabilities of EVG’s ComBond® high-vacuum bonding system and low-temp laser debonding...
EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo...
EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications
Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of... Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image...
UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems
Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from...
EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Wafer Bonder for 3D Chip Stacking Production Applications
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related... 