wafer bonding

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

EVG continues win streak with 17th consecutive year listed among “THE BEST” suppliers in survey results; frequently cited by customers as best at partnering and recommended supplier EV Group (EVG) today announced that it has once again been voted by customers as one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of 2019’s  BEST Suppliers of Fab Equipment in the 2019 V... »

10 Years of Invent, Innovate, Implement at EV Group

10 Years of Invent, Innovate, Implement at EV Group

Of all the companies that have supported 3DInCites over the past 10 years, none has been more consistently involved, both as contributor and sponsor, as EV Group. In fact, without EVG’s belief in our mission and their sponsorship the first three years, I doubt 3DInCites would still exist today. Therefore, it seemed fitting to honor them with the cover story for our 10th Anniversary print edition... »

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced wafer bonding solutions will be highlighted in several papers being presented at the 2019 IEEE 69th Electronic Components and Technology Conference (... »

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology for nex... »

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG® ... »

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company’s industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion and hybrid wafer bonding, the... »

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG’s “Manufacturing III” facility, which will more than double the floor space for the final assemb... »

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since expanded its presence to include offices in Fukuoka and a state-of-the-art applic... »

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and te... »

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafe... »

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