Latest Posts - Page 5
Catching Up with Dongkai Shangguan about NCAP China
If you have an ear out for the new in the world of 3D IC technology as I do, then you...
Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials...
Motivation for 3D IC and other Key Take-Aways from the IEEE 3D IC Conference
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all... MonolithIC 3D Inc. at the 2013 IEEE 3DIC Conference
Monolithic 3D is far more than just an alternative to 0.7x scaling. Zvi Or-Bach, President and CEO will present a...
Shaping the Future of MEMS, Sensors, and 3D IC: Fertile Grounds for Collaboration
STMicroelectronics brought a “Who’s Who” of thought leaders from across the MEMS and Sensors ecosystem to Santa Clara, CA, on...
TSMC 3D IC Reference Flows; A Leap Forward for the HMC
Big news for 3D ICs this week as TSMC and its OIP Ecosystem Partners announce the release of silicon-validated reference...
3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make
Recent signs that we’re getting closer to commercialization of 3D ICs? For one, analog and sensor IC company, ams AG,... Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing
Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3,... Rudolph Announces New Metrology Suite for Advanced Packaging
New NSX Metrology Series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC Rudolph...
SSEC’s New Chemistry for TSV Reveal
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a...
Interview with imec’s Ludo Deferm: Packaging Design Kits and Debond Solutions
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought...
Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...
It Takes an Ecosystem to Launch 2.5D and 3D Integration
As 2.5D and 3D IC technologies round the ten-year development mark and volume manufacturing keeps getting pushed just beyond our...
And a Good Time was had by All – 3D InCites Awards Breakfast, 2013
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge...
2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on...
Sum of Minds – imec Makes the Unexpected Happen
In her opening remarks at the 2013 imec International Technology Forum (ITF), held Monday, July 8, 2013, Karen Savala, SEMI,...
Late Breaking SEMICON West News: Expert TechHUBs Added to this Year’s Agenda
New this year at SEMICON West, and just introduced to the program late last week, the Expert TechHUBs will help...
3D InCites Awards Public Opinion Poll Results Are In!
The public opinion poll closed for the first annual 3D InCites Awards on Wednesday July 3, with over 1350 votes...
