Francoise News - Page 25
News of 3D NAND Fab Construction: A sign of Progress or a PR Ruse?
While I don’t claim to be an expert in 3D NAND technologies, I do keep my eye on what’s happening... NORDSON Dage: XM8000 Wafer X-ray Metrology Platform
Fully automatic, in-line X-ray metrology platform for the measurement and defect capture of both optically hidden and visible features in...
ECTC 2014: A Preview of 2.5D and 3D Activities
Each year, the agenda of Electronic Components Technologies Conference (ECTC), an international conference sponsored by the IEEE Components, Packaging, and Manufacturing...
AMD’s Bryan Black to Deliver 2014 3D InCites Awards Breakfast Keynote
Panel of judges expanded and Reader’s Choice Award added PHOENIX – May 12, 2014 – 3D InCites, the premier online...
An Open Letter to Chip and System-level Designers Regarding 3D Integration
Dear Chip and System-level Designers, Allow me to introduce myself. My name is Françoise von Trapp, and I am known...
Process Improvements Target 3D IC Cost of Ownership
Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s...
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
3D IC Adoption: What’s it going to Take?
If, as we heard at last week’s 3D IC Forum at SEMICON Singapore, that technology challenges and cost are no...
SEMICON Singapore 2014: A Rosy Outlook for 2.5D and 3D ICs
This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to...
2013 ITRS Roadmap Calls for 3D Power Scaling; Monolithic 3D Gains Traction
At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS), which has traditionally... Rudolph Technologies: JetStep S Series Lithography System
As advanced packaging facilities transition their manufacturing from round wafers to square panels, the JetStep S Series Lithography System is...
GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?
Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
ASE and Inotera Memories to Offer Novel 2.5D Manufacturing Solutions
Last week, ASE and Inotera Memories announced they had entered into a joint development project (JDP) intended to both strengthen...
Oerlikon Systems: Pragmatic and Poised for 3D IC High Volume Manufacturing
In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the...
Cascade Microtech: In the imec 3D Test Lab
My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of...
Cascade Microtech Breaks Through the Barriers of 3D Test
For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has...
3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool Readiness
Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion...
3D Integration Workshop Faces Reliability Challenges Head On
The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about... 