ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape
When I interview members for the 3D InCites Podcast at industry events, I often ask them, “What did you come here to learn?” As this is my first time at ISS Europe, I asked myself that question. Here’s what I came up with. I attended ISS Europe 2024 to learn...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device Packaging Conference (DPC), is scheduled from March 18 to 21 in Fountain Hills, AZ. Simultaneously, the Workshop on Advanced Packaging for Medical Microelectronics will take place at the WeKoPa Resort...
IFTLE 586: US CHIPS Act Monies Begin to Flow
US Chip Fabrication, Packaging & Assembly Industry In August 2023, one year after the U.S. CHIPs Act was signed into law, the White House announced that over 460 companies had already submitted statements of interest to receive funding. GlobalFoundries The U.S. Dept of Commerce has announced $1.5B in direct funding...
SEMICON China 2024 Community Member Preview
SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to draw the attention of the global semiconductor supply chain as the country continues considerable capacity expansion to increase its share of global semiconductor capacity. According to the SEMI Year-End Total Semiconductor...
February Member Highlights – Acquisitions, Awards, Events, New Offerings and More
The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product introductions, events, job openings, and more. Here’s a collection of February member highlights. Acquisitions, Partnerships and Collaborations ASE announced a strategic partnership with Infineon Technologies, to acquire two back-end manufacturing...
IFTLE 585: Lincoln Labs Chiplet Technology for ELAICs
The February issue of Chip Scale Review contained an interesting article entitled “Heterogeneous Chiplet Integration to Make Megachips” authored by members of the advanced technology division of MIT’s Lincoln Labs. The work had previously been shown at the 2023 IEEE ECTC. While I don’t see anything revolutionary about their technology...
Fueling the Workforce Through Investment and Engagement
It is an exciting time to be an equipment manufacturer in the European semiconductor industry. There is still a lot of buzz around the EU Chips Act and companies like Intel, TSMC, and GlobalFoundries & STMicroelectronics have announced huge investments in Europe over the next few years. However, Europe is...
What the Ski and Semiconductor Industries Have in Common
From November to April for the past seven years, I have spent a considerable amount of time on the snow as a ski instructor. In 2019 the International Ski and Snowboard Federation implemented a ban on fluorinated waxes that took place in July of 2021. The change left skiers scrambling,...
IFTLE 584: SK hynix HBM Is Coming to the US; Intel Pushes Back Ohio Chip Fab
Onshoring SK hynix HBM Multiple reports indicate that SK Hynix is poised to announce its first major U.S. investment: A $15B+ advanced packaging facility. SK hynix is reportedly picking Indiana as its geographic site, but has Arizona available as a second choice, according to those close to the negotiations. While...
Addressing the Semiconductor Talent Shortage: Think Globally, Act Locally
In addressing the global semiconductor talent shortage, Mosaic Microsystems’ approach is to think globally and act locally. We aim to become a leading worldwide supplier of glass interposers to the semiconductor industry by building on the considerable ecosystem in Rochester, NY, where a talented labor pool and top-notch colleges and...
No Slow Down In Sight for Semiconductor Growth in China
At ISS 2024, SEMI reported that fab equipment sales look to be flat in 2024 — right around $100 billion. We won’t know for sure until the final numbers are in for the year, but at the moment, it’s a pretty good estimate. TechInsights has wafer fab equipment (WFE) coming...
Rapid Development and Optimization of Thermal Management Solutions for Advanced Semiconductor Packaging
As the power density increases for semiconductor devices, thermal management is becoming an ever more critical challenge for reliability and performance, for high-performance computing, AI, data center, power electronics, and other applications. Heat dissipation is often a great concern as the junction temperature rises with an increased power density, which...
The Year in Semiconductor Device Test
Is semiconductor device test non-value added? Certainly, some aspects are unchanging. Test is one of the three means to guarantee parts in addition to characterization and the design itself. Given the market backdrop – across automotive, computing, and advanced packaging – new test challenges and value adds have emerged. Three...
IFTLE 583: DoD funding for U.S. Based Substrate Manufacturing
IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA) were invented by U.S. companies like Motorola, production capacity was all off-shored to Asia years ago. Having competent U.S. production capacity has always been part of the US reshoring program....
Fostering Innovation from Within
As many organizations in the industry are grappling for external resources, Onto Innovation has expertly chosen to look inward. We recognize the unmatched talent that exists at our company already and have implemented a course of action that directly taps into that. Our employees continuously push the boundaries of innovation,...
Announcing the Winners of the 2024 3D InCites Awards
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to improve the program. We intended to provide more opportunities for participation across the heterogeneous integration supply chain, and we are happy with the outcome. A special thank you to the...
January Member Achievements, New Hires and Grand Openings
Members of the 3D InCites community hit the year running by celebrating milestones, new hires, promotions, and grand openings. Here are some highlights that caught our attention. Amkor Technology, Inc. hosted DesignCon2024 at the Santa Clara Convention Center in Santa Clara, CA Among the speakers was Amkor’s Ruben Fuentes, VP...
IFTLE 582: SK hynix Looks at the Future of Memory Packaging for AI
At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at “Advanced Packaging Technology in Memory Applications for Future Generative AI Era”. [Generative AI creates new content through the use of machine learning models such as generative adversarial networks. Such frameworks...
The Semiconductor Cycle: Looking Into the Future
“It ain’t over till it’s over.” is a frequently used Yogi Berra saying. The current semiconductor cycle has that feeling. While for some parts it appears to be over, for other parts it looks like most segments are at the bottom, and there are no strong growth indicators for the...
ESG Resolutions
Happy 2024! For many the start of the New Year includes resolutions or goals to try to accomplish throughout the year. From a sustainability standpoint, this means that the ESG teams are collecting the data from 2023 to determine if they achieved what they had published in their 2022 sustainability...
