Latest Posts
July Member News: Bold Investments and Strategic Acquisitions
July marked a dynamic period for our community members, characterized by bold investments, strategic acquisitions, and advancements in AI-driven design...
Innovative High-density Adaptive Redistribution Technology for HIgh I/O Embedded Devices
By Lars Böttcher, Ruben Kahle, Claudia Landstorfer, Dionysios Manessis and Andreas Ostmann, Fraunhofer IZM To meet the requirements of high-density...
April Member News: A More Connected and Sustainable Future
April 2025 marked a dynamic month for the semiconductor industry, with major developments across technology, sustainability, and global collaboration. Companies...
Multi Physics Analysis of 3D Integrated Circuits
3D integration is becoming a valuable alternative to the ongoing, yet challenging, transistor scaling known as Moore’s Law. This is...
March Member News: Shaping the Future of Technology
In the month of March, the semiconductor industry saw significant advancements, strategic expansions, and key industry events shaping the future...
Will the CHIPS ACT Be “DOGE’d?” And Other Musing from IMAPS Device Packaging 2025
There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites...
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb...
IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners
Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of...
October 2024 Member News
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
May Member News: Strategic Moves, Product Launches, Sustainability and more
May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product...
Member Monthly Highlights – November
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Call for Papers: IMAPS DPC 2024
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an...
Kristie Bowman Joins IMAPS as Manager, Events and Programs
Kristie will manage and produce IMAPS meetings from conception through completion. Her event responsibilities will include organizing a wide range...
IFTLE 565: High-Density Build-Up Substrates and SHIP Update
IMAPS Reshoring Part 2: High-Density Build-Up Substrate Discussions Picking up where we left off in IFTLE 564, the second discussion...
CHIPCon 2023: Demystifying the Chiplet Ecosystem
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose....
