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CHIPcon Community Member Preview
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
IMAPS & IPC to Host On-Shoring Workshop July 10-12, 2023 in Washington, DC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to... IMAPS Advanced SiP Conference is now CHIPcon
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
IMAPS Advanced System-in-Package Conference is now CHIPcon
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023 IMAPS...
StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences
Santee, Calif. — StratEdge Corporation,leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and...
IMAPS Device Packaging Conference Returns to Arizona in March 2023
The Most Comprehensive Program for Microelectronics and Advanced Packaging This Spring The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16,...
Community Member Monthly Highlights – December
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
IFTLE 540: IMAPS Symp 2022: Nano-porous Copper; Adaptive Formed Glass
IMAPS 2022 Continued… This year’s IMAPS Symposium in Boston drew 925 attendees and featured: 20 technical and poster sessions 11...
IFTLE 537: 2022 IMAPS Society Awards Go to Advanced Packaging Superstars
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some...
Deca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium
Founder’s Award honors individuals who have made the most significant contributions to the microelectronics packaging industry Tempe, Ariz. – October...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
Are You Listening? 3D InCites Summer Podcast Wrap Up
Are you listening to the 3D InCites podcast yet? We had a busy summer! Our listenership grew, and we achieved...
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs
Experts available at BCICTS 2022 and IMAPS 2022 to analyze your high-frequency packaging needs Santee, Calif. — 9 September 2022 — StratEdge... IMAPS to Host Workshop on Strategies to Revitalize the On-Shore Packaging and Assembly Defense Industrial Base
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve...
Indium Corporation Experts to Present at IMAPS 2022
Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6...
What’s Happening at the IMAPS SiP Conference?
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP...
IMAPS International Symposium 2021 – It’s Great to be Back!
Oh, how I missed those hallway conversations! And last week’s IMAPS International Symposium 2021 did not disappoint. It was so...
IMAPS 2021 Community Member Preview
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations...