Latest Posts - Page 5
Packaging, Innovation, and Our Application-Driven World
MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review,...
European 3D Summit 2018: Fraunhofer Tour and Presentations
This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a...
Can We Thank Aristotle for Heterogeneous Integration?
A couple of years ago we may not have predicted that in 2018 there would be a growing demand for...
The Truth About Moore’s Law is Revealed at 3D ASIP 2017
I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper....
MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at...
SEMICON West 2017: The Semiconductor Industry at a Young 50
The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over...
Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)
In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions...
Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)
Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)At SEMICON West 2016, the big story was the end of...
Heterogeneous Integration Makes an End Run Around 7nm Silicon at SEMI ASMC 2017
I like to think that someday soon a perfectly ripe tomato growing on a vine is going to signal its...
The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer
It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the...
MEMS Ascendant at IMAPS Device Packaging 2017
Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at...
3D TSVs are essential for Heterogeneous Integration, HPC and High-end Memory
This year again, both market segments, high end, and low end, are the main targets of through silicon via (TSV)...
The New Heterogeneous Integration Roadmap: Seeing Beyond the Lamp Post
If you, like me, have been wondering about when and where it was you last saw an International Technology Roadmap...
Moore’s Law Passes the Silicon Stress Test at SEMI ASMC 2016
Stress Test, noun: “A test designed to assess how well a system functions when subjected to greater than normal amounts...
“How Do You Create The Future?” Through Innovations in Heterogeneous Integration and SiP
MEPTEC Luncheons returned big to The Bay Area on Wednesday, May 25, 2016, with a new venue (SEMI HQ), a...
3D IC Test: Now and The Road Ahead
Solutions for 3D IC test are ready today, but they will be more ready tomorrow. At the 2015 ISTFA, I...
EV Group Technology Day Examines Photonics, Nanoimprint Lithography, 3D and MEMS
It’s been two years since I last visited EV Group headquarters in Schärding, Austria, so I was glad to be able...
Combining Technology Platforms and Integrating Complex Materials for New Applications
Heterogeneous integration is in many ways different from other research technology platforms. For one thing, the technology is mostly driven...
